In-Space Temperature Sensor Layout for Non-Interfering Wafer Processing

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Solution Overview

Problem

Existing temperature sensor configurations in semiconductor manufacturing interfere with substrate processing, necessitating a solution to place a temperature sensor within the processing space without affecting the substrate processes.

Innovation Solution

A temperature sensor is positioned between substrates supported by a substrate support, with a detector column extending vertically to maintain the sensor's lower end at or above the support's height, ensuring it is farther from the processing space than the support column, allowing accurate temperature measurement without interference.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the temperature sensor is disposed in the processing space, then the temperature measurement accuracy is improved, but the substrate processing is interfered with

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidsubstrate processing interference
Core Design Contradiction:
Measurement precisionVSObject-affected harmful factors

Solution Approach 1:

The temperature sensor is positioned in the vertical dimension above the substrate processing space, utilizing the space above the substrate support. The sensor extends downward to measure temperature near the substrate without horizontally intruding into the processing space, thus avoiding interference with substrate handling and processing operations while maintaining measurement accuracy.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The temperature sensor acts as an intermediary element positioned between the heating source and the substrate, measuring temperature in the processing space without directly contacting the substrate or interfering with substrate processing operations. The sensor's strategic positioning allows it to mediate temperature measurement while the substrate support structure prevents interference with substrate handling.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Speed

If the temperature sensor is moved together with the substrate support, then the temperature control responsiveness is improved, but the device complexity is increased

Engineering Contradiction:
Improvetemperature control responsivenessVSAvoidsensor positioning mechanism
Core Design Contradiction:
SpeedVSDevice complexity

Solution Approach 1:

The temperature sensor is merged with the substrate support structure, where the sensor is disposed on or integrated into the substrate support. This combination allows the sensor to automatically move with the substrate support during substrate loading and processing operations, eliminating the need for separate positioning mechanisms while maintaining temperature control responsiveness.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The substrate support structure serves multiple functions: it supports the substrate during processing and simultaneously positions and moves the temperature sensor. This multi-functionality reduces device complexity by eliminating dedicated sensor positioning mechanisms while maintaining the sensor's ability to track substrate position and provide responsive temperature control.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables accurate temperature measurement and control within the processing space, reducing interference and shortening temperature stabilization time during substrate processing.

Implementation Method 1

a temperature measurer disposed in a processing space formed between substrates supported by supports of a substrate support

Methodology Applied
Scientific EffectTemperature measurement: Thermocouple

Data Source

PatentUS20250004489A1Temperature sensor, substrate processing apparatus, method of manufacturing semiconductor device, and temperature control system
Publication Date: 2025.01.02 KOKUSAI DENKI KK
  • US20250004489A1 patent drawing
  • US20250004489A1 patent drawing
  • US20250004489A1 patent drawing

AI summary

There is provided a technique that includes: a temperature measurer disposed in a processing space formed between substrates supported by supports of a substrate support; a detector in which the temperature measurer is provided; and a column extending in a vertical direction so as to support the detector in a horizontal direction, wherein a lower end of the detector is arranged at a same height position as a lower end of each of the supports or at a higher position than the lower end of each of the supports, and wherein a surface of the column near the processing space is arranged farther from the processing space than a surface of a support column near the processing space, the support column being configured to support each of the supports in the horizontal direction.