In-Substrate Magnetic-Core Inductor for High Inductance Density
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Solution Overview
Problem
Current inductor devices in semiconductor technology face challenges in achieving high inductance while maintaining compactness, and existing fabrication techniques are not efficient in integrating magnetic materials effectively to enhance inductance.
Innovation Solution
The development of an inductor device that includes a substrate with vias filled with conductive metal and a magnetic material via structure, interconnected by patterned metallization layers to form a winding around a magnetic core, which enhances inductance and compactness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional inductor fabrication techniques are used, then manufacturing process is simple, but inductance value is low and device area is large
Solution Approach 1:
The patent embeds a magnetic core structure within the inductor device, nesting the magnetic material inside the winding structure formed by conductive vias and metallization layers. This nested configuration concentrates magnetic flux within a compact volume, achieving high inductance in a small footprint area.
Solution Approach 2:
The patent transitions from planar inductor designs to a three-dimensional structure by stacking multiple layers of conductive vias and metallization layers vertically. This vertical stacking in the Z-dimension allows the winding to enclose the magnetic core in three dimensions, significantly increasing inductance density per unit area.
2Manufacturing precision
If magnetic material is added to enhance inductance, then inductance value increases, but fabrication complexity increases
Solution Approach 1:
The magnetic core structure is formed and positioned within the substrate before the conductive vias and metallization layers are deposited. This preliminary placement of the magnetic core allows subsequent standard semiconductor fabrication steps to proceed without additional complexity, as the magnetic material serves as a pre-positioned element rather than a later addition.
Solution Approach 2:
The patent utilizes changes in material properties and structural parameters, such as the permeability of the magnetic core and the geometry of the winding, to optimize inductance. By adjusting these parameters within the existing fabrication framework, high inductance is achieved without fundamentally altering the manufacturing process complexity.
3Area of stationary object
If inductor size is reduced for compactness, then device area decreases, but inductance value drops
Solution Approach 1:
The patent employs a composite structure combining conductive materials (for vias and metallization layers) with magnetic materials (for the core). This composite design leverages the high permeability of the magnetic material to concentrate flux, allowing the inductor to maintain high inductance values despite the reduced overall device area.
Solution Approach 2:
The magnetic core is strategically positioned in specific locations within the inductor structure where it can most effectively concentrate magnetic flux. This localized placement of magnetic material optimizes the inductance-to-area ratio by ensuring that the magnetic enhancement is concentrated where it provides the greatest benefit to the overall inductance while minimizing the device footprint.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in a compact inductor with high inductance, facilitating efficient power delivery in semiconductor devices and enabling integration with other components in electronic circuits.
Implementation Method 1
a via structure disposed through the substrate and extending between the plurality of vias, wherein the via structure is filled with a magnetic material to form a magnetic core of the inductor
Implementation Method 2
the one or more patterned metallization layers and the conductive metal filling the plurality of vias form a winding of the inductor about the magnetic core
Data Source
AI summary
Disclosed is a device including an inductor that includes a substrate; a plurality of vias disposed through the substrate and filled with a conductive metal; a via structure disposed through the substrate and extending between the plurality of vias, wherein the via structure is filled with a magnetic material to form a magnetic core of the inductor; and one or more patterned metallization layers interconnecting the conductive metal of the plurality of vias; wherein the one or more patterned metallization layers and the conductive metal filling the plurality of vias form a winding of the inductor about the magnetic core.