Implantable Electronic Package Via Placement for Thinner IC Packaging
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Solution Overview
Problem
The miniaturization of implantable medical devices (IMDs) poses challenges in reducing the size and increasing the density of electronic circuitry components while maintaining effective packaging and connectivity.
Innovation Solution
The development of an electronic package with a conductive via disposed through an inactive region of a package substrate, separated from the active region by a portion of the inactive region, allowing for electrical connection to integrated circuits via patterned conductive layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dimensions of IMDs and electronic circuitry components are reduced to achieve miniaturization, then the overall device size decreases, but the density and compactness of electronic components become more difficult to maintain
Solution Approach 1:
The patent utilizes the vertical dimension by forming vias through the package substrate to connect integrated circuits on different layers. This three-dimensional packaging approach allows components to be stacked vertically rather than only arranged horizontally, increasing component density while reducing the overall device footprint. The via structure enables electrical connections between multiple circuit layers, effectively utilizing vertical space to maintain high component density in a miniaturized device.
2Volume of moving object
If embedded integrated circuits are used to increase density and reduce size, then component compactness improves, but the complexity of packaging techniques increases
Solution Approach 1:
The package substrate is divided into distinct active and inactive regions, with integrated circuits placed in active regions and vias formed in inactive regions. This segmentation allows for independent optimization of different areas: active regions focus on circuit functionality while inactive regions are dedicated to vertical interconnect formation. The separation simplifies the manufacturing process by enabling via formation in non-critical areas without affecting circuit performance, thereby reducing overall packaging complexity.
Solution Approach 2:
The package substrate acts as an intermediary layer between the integrated circuits and the external environment. It provides a structured platform that organizes multiple circuits and their interconnections, managing the complexity of wiring and signal routing. The substrate's layered structure with defined active and inactive regions serves as a mediator that simplifies the integration of multiple components while maintaining signal integrity and electrical isolation where needed.
3Reliability
If vias are formed through the entire package substrate to connect integrated circuits, then electrical connectivity is achieved, but the overall thickness of the package increases
Solution Approach 1:
The via formation process is extracted and localized to specific inactive regions of the package substrate rather than requiring complete through-substrate vias. This allows vias to be formed only where needed for electrical connections, and the inactive regions can be optimized for via placement without compromising circuit functionality. The separation of via locations from active circuit areas enables thinner substrate design while maintaining necessary electrical connectivity.
4Ease of manufacture
If the active region is separated from vias by inactive region portions, then manufacturing flexibility is improved, but the substrate area available for circuits is reduced
Solution Approach 1:
The package substrate is designed with heterogeneous regions having different properties: active regions optimized for circuit integration and inactive regions optimized for via formation. This local differentiation allows each region to be optimized for its specific function without compromising the other. The inactive regions provide dedicated spaces for via formation that do not interfere with active circuit areas, enabling manufacturing flexibility while preserving maximum substrate area for functional circuits.
Data Source
AI summary
Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate. The conductive via is separated from the active region by a portion of the inactive region of the substrate.