Inclined Base Material Light Source Device Thermal Management
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Solution Overview
Problem
Existing light source devices using semiconductor lasers face challenges in miniaturization due to high heat density, leading to temperature rise and reduced lifetime, as increasing the arrangement density of semiconductor laser elements exacerbates heat generation issues.
Innovation Solution
A light source device configuration featuring a base material with inclined extending portions to reduce light-emitting element density, coupled with collimating lenses and a heat-receiving portion for efficient heat dissipation, along with a temperature buffer member to manage thermal expansion, allowing for higher luminance and reduced temperature rise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the arrangement density of semiconductor laser elements is increased to miniaturize the light source device, then the device size is reduced, but the temperature rise increases due to high heat density
Solution Approach 1:
The base material extends in an inclined second direction rather than perpendicular to the light emission direction. This dimensional reorientation allows heat to dissipate along a longer path through the base material, reducing temperature rise while maintaining a compact device footprint in the vertical direction.
Solution Approach 2:
The inclination angle of the base material's extension direction is optimized to balance between heat dissipation efficiency and device miniaturization. By adjusting this geometric parameter, the patent achieves both reduced temperature rise and compact size.
2Illumination intensity
If the arrangement density of semiconductor laser elements is increased to achieve high luminance, then the luminance is improved, but the temperature rise increases due to high heat density
Solution Approach 1:
By extending the base material in an inclined direction, the patent creates an extended heat dissipation pathway that is decoupled from the light emission direction. This allows multiple light-emitting elements to be arranged closely for high luminance while heat dissipates efficiently along the inclined base material structure.
3Productivity
If the arrangement density of semiconductor laser elements is increased, then the productivity is improved, but the temperature rise increases due to high heat density
Solution Approach 1:
The inclined extension of the base material provides extended surface area for heat dissipation without increasing the vertical profile of the device. This enables higher arrangement density of light-emitting elements while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The configuration enables high luminance emission with reduced temperature rise and extended lifetime, allowing for miniaturization of light source devices while maintaining efficient heat dissipation and stable element placement.
Implementation Method 1
heat generated by the plurality of light-emitting elements can be efficiently discharged through the base material
Implementation Method 2
a collimating lens that collimates the light emitted by the first light-emitting element
Implementation Method 3
a temperature buffer member to manage thermal expansion
Data Source
AI summary
A light source device includes: a plurality of light-emitting elements including a first light-emitting element and a second light-emitting element each of which emits light in a first direction; and a base material including a base portion that extends in a second direction inclined with respect to the first direction. The plurality of light-emitting elements are disposed along the second direction on one side of the base portion.