Inclined Bump Pad for Semiconductor Package Short Circuit Prevention
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Solution Overview
Problem
The challenge in semiconductor packaging is the increasing complexity of miniaturization and multi-functionalization of electronic devices, which requires finer connection terminals and reduced spacing between bump structures to prevent short circuits and improve electrical reliability, while maintaining high performance and capacity.
Innovation Solution
A semiconductor package design featuring a bump pad with an inclined side surface under the bump structure, which guides protruding portions of the bump structure downward, preventing adjacent bumps from bonding and thus reducing the likelihood of shorts, and enhancing electrical characteristics and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the spacing between bump structures is decreased to achieve miniaturization, then the capacity and integration of the semiconductor package is improved, but the risk of short circuits between adjacent bumps increases
Solution Approach 1:
The inclined side surface of the bump pad acts as an intermediary structure between adjacent bump structures. This intermediate feature redirects protruding portions of bumps away from each other, preventing direct contact and short circuits while allowing the bumps to maintain their functional proximity for high-capacity connections.
Solution Approach 2:
The inclined side surface is designed in advance to counteract the potential harmful effect of bump protrusion. By providing this pre-configured geometric feature, the patent prevents short circuits before they can occur, even when bumps experience thermal expansion, mechanical stress, or manufacturing variations that cause them to protrude.
2Length of moving object
If the bump structures are made finer to achieve miniaturization, then the connection terminal size is reduced, but the manufacturing precision required increases
Solution Approach 1:
The bump pad is designed with non-uniform geometry, featuring an inclined side surface that provides different characteristics at different locations. The inclined portion provides guidance and protection, while the flat upper portion provides a stable bonding surface. This local differentiation allows the structure to accommodate manufacturing variations while maintaining fine dimensions.
3Productivity
If the bump structures are made finer and closer together, then the semiconductor package achieves higher capacity, but the electrical characteristics and reliability deteriorate
Solution Approach 1:
The inclined side surface serves as a protective intermediary that isolates adjacent fine bump structures from each other. This prevents electrical interference and short circuits between closely-spaced bumps, thereby maintaining reliable electrical characteristics even when bumps are made finer and placed closer together for higher capacity.
Data Source
AI summary
Provided is a semiconductor package including: a first substrate having a first electrode pad and a first protective layer in which a cavity is formed; a first bump pad arranged in the cavity and connected to the first electrode pad; a second substrate facing the first substrate and having a second bump pad; and a bump structure in contact with the first bump pad and the second bump pad, wherein the first electrode pad has a trapezoidal shape, and the first bump pad has a flat upper surface and an inclined side surface extending along a side surface of the first electrode pad.