Inclined Computing Devices for Data Center Cooling
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Solution Overview
Problem
Existing data centers face inefficiencies in waste heat removal due to non-uniform heat generation across rack systems, relying on costly and inefficient server fans, and airflow restrictions within rack systems, which reduce cooling effectiveness.
Innovation Solution
Inclining computing devices within rack systems to promote airflow through natural convection, using adjustable brackets and air directing devices to optimize heat removal based on component density and power usage, and implementing automatic incline adjustment mechanisms to enhance cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If server fans are used to produce airflow through servers in racks, then cooling effectiveness is improved, but device complexity and cost increase
Solution Approach 1:
The patent removes the need for active cooling fans by extracting the harmful dependency on mechanical airflow generation. Instead, it utilizes natural convection currents that arise from the temperature difference between hot and cold air, allowing cooling to occur passively without additional moving parts or mechanical complexity in the server units.
Solution Approach 2:
The cooling system becomes self-service by leveraging the natural buoyancy of hot air rising and cold air sinking to create continuous airflow circulation. The heat-generating components themselves drive the cooling process through natural convection, eliminating the need for external fan-driven airflow generation.
2Ease of manufacture
If uniform heat removal methods are applied to non-uniform waste heat generation sources, then simplicity is maintained, but heat removal efficiency decreases
Solution Approach 1:
The patent applies local quality by configuring rack systems with varying incline angles tailored to specific heat generation patterns. racks with higher density heat-generating components are positioned at greater inclines to enhance natural convection, while racks with lower heat generation use smaller inclines, optimizing cooling efficiency for each local condition rather than applying a uniform approach.
3Strength
If airflow is forced to change direction at rack openings and enclosures, then structural integrity is maintained, but airflow rate decreases
Solution Approach 1:
The patent introduces a new dimensional approach by tilting racks at incline angles, transforming the airflow path from a constrained horizontal direction through openings into a three-dimensional diagonal flow path. This dimensional change allows air to enter and exit racks at optimized angles that reduce flow restrictions while maintaining structural integrity, improving overall airflow rate despite the presence of enclosures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves airflow and heat removal efficiency by promoting natural convection and optimizing airflow paths, reducing the need for costly server fans and enhancing cooling effectiveness across non-uniform heat generation sources.
Implementation Method 1
The air moving devices can move air from the lower end of the inclined computing devices to the higher end of the inclined computing devices such that heat is removed from heat producing components in the inclined computing devices
Data Source
AI summary
A data center includes one or more racks, one or more computing devices coupled to at least one of the racks, and one or more air moving devices. The computing devices include heat producing components. The computing devices may be inclined in the rack such that the lower ends of the computing devices are at a lower elevation than the higher ends of the computing devices. The air moving devices can move air from the lower end of the inclined computing devices to the higher end of the inclined computing devices such that heat is removed from heat producing components in the inclined computing devices.