Inclined Conductive Structure for UV Curing in Display Substrates
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Solution Overview
Problem
The adhesive property of sealants in curved display panels is compromised due to stress and mechanical vibrations, leading to potential liquid crystal leakage, and the UV curing process often leaves uncured areas, affecting the sealant's strength.
Innovation Solution
A display substrate design with a working area and a sealant setting area, featuring a first and second conductive structure with inclined parts that allow light to be reflected and irradiate the sealant, enhancing UV curing and adhesive properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the sealant is applied in the sealant area outside the display area, then the bonding and sealing functions are achieved, but the UV curing is incomplete leaving uncured areas that compromise adhesive strength
Solution Approach 1:
The patent introduces a three-dimensional inclined conductive structure that extends from the base substrate upward, creating multiple surfaces (inclined surface and top surface) at different spatial dimensions. This dimensional expansion allows UV light to access the sealant from multiple angles and paths, ensuring complete curing throughout the sealant volume rather than leaving uncured areas in traditional planar configurations.
Solution Approach 2:
The conductive structure serves as an intermediary element between the UV light source and the sealant. By positioning the sealant on both the inclined surface and top surface of the conductive structure, the patent creates intermediate light transmission paths that facilitate uniform UV distribution across all sealant regions, eliminating shadowed or uncured areas.
2Strength
If the sealant is used to support cell gap and seal liquid crystals, then the structural integrity is maintained, but stress and mechanical vibrations compromise the adhesive property leading to potential leakage
Solution Approach 1:
The patent ensures complete UV curing of the sealant in advance during the manufacturing process by utilizing the multi-surface conductive structure for uniform light distribution. This preliminary complete curing creates maximum adhesive strength before the product undergoes mechanical stress or vibrations during use, preventing future bonding failures and leakage.
Solution Approach 2:
The patent changes the physical configuration of the conductive structure from a traditional planar form to a three-dimensional form with inclined surfaces. This parameter change in structure geometry transforms the UV light interaction with the sealant, enabling complete curing that maximizes adhesive properties and resistance to mechanical stress.
3Manufacturing precision
If the conductive structure is designed with inclined parts to reflect light, then UV curing uniformity is improved, but the device complexity increases
Solution Approach 1:
The conductive structure in the patent serves multiple functions simultaneously: it provides electrical conduction, mechanical support, and optical reflection/redirecting. By integrating these multiple functions into a single multi-surface structure, the patent achieves uniform UV curing without proportionally increasing device complexity, as the same structural element performs diverse roles.
Solution Approach 2:
The patent employs an inclined surface geometry that redirects UV light at specific angles to ensure uniform distribution across the sealant area. This curved or angled surface design optimizes light reflection patterns to eliminate shadowed regions while maintaining a relatively simple overall structure that does not excessively complicate the device.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves the adhesive strength of the sealant by ensuring uniform UV curing and resistance to mechanical vibrations, preventing sealant damage and leakage.
Implementation Method 1
the inclined part is configured to allow at least part of light to be exited out directly over the first conductive structure after the light incident into the inclined part from a second side of the base substrate opposite to the first side is reflected by the inclined part
Data Source
AI summary
A display substrate, a manufacturing method thereof and a display device. The display substrate includes a working area and a sealant setting area outside of the working area. The display substrate further includes: a base substrate, a first conductive structure on a first side of the base substrate, and a second conductive structure on one side of the first conductive structure away from the base substrate. The first conductive structure and the second conductive structure are in the sealant setting area. The second conductive structure at least includes an inclined part inclined relative to a main surface of the base substrate. The inclined part is configured to allow at least part of light to be exited out directly over the first conductive structure after the light incident into the inclined part from a second side of the base substrate opposite to the first side is reflected by the inclined part.