Inclined Flexible Wiring Substrate for Compact Liquid Ejecting Head

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Solution Overview

Problem

The challenge is to reduce the size of liquid ejecting heads while maintaining a sufficient area for forming liquid flow paths, as reducing the size of the flow-path member restricts the routing flexibility and optimal flow path configuration, particularly in ink jet type recording heads.

Innovation Solution

The liquid ejecting head design incorporates a flexible wiring substrate that is inclined towards one surface, allowing a wider area for flow path formation on the opposite surface, enabling optimal flow path configuration and reducing interference with the wiring substrate, thus allowing for a smaller head size.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If the size of the flow-path member is reduced, then the size of the liquid ejecting head is reduced, but the area for forming liquid flow paths is reduced and routing flexibility is restricted

Engineering Contradiction:
Improvesize of liquid ejecting headVSAvoidarea for forming liquid flow paths
Core Design Contradiction:
Volume of moving objectVSArea of stationary object

Solution Approach 1:

The flexible wiring substrate is positioned at an inclined angle relative to the flow-path member, utilizing three-dimensional spatial arrangement. This allows the wiring substrate to extend over the flow path area without occupying horizontal space, thereby maintaining sufficient flow path formation area while enabling compact head design. The inclined positioning creates vertical separation between wiring and flow paths, resolving the space conflict.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The flexible wiring substrate is designed with asymmetric positioning where one end is connected to the head main body and the other end extends toward the flow-path member at an angle. This asymmetric arrangement optimizes the use of available space, allowing the wiring to be routed efficiently without symmetric constraints, thereby maximizing the flow path area within the reduced head size.

Inventive Principle:
Principle #4Asymmetry

2Volume of moving object

If the size of the flow-path member is reduced, then the size of the liquid ejecting head is reduced, but the degree of freedom in routing the flow path is reduced

Engineering Contradiction:
Improvesize of liquid ejecting headVSAvoiddegree of freedom in routing flow path
Core Design Contradiction:
Volume of moving objectVSAdaptability or versatility

Solution Approach 1:

By introducing vertical dimension through inclined positioning of the flexible wiring substrate, the design gains additional routing freedom. The flow path can be configured in the horizontal plane while the wiring substrate extends diagonally in three-dimensional space, providing multiple routing options that would not be available in a purely two-dimensional constrained space.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The flexible wiring substrate is positioned specifically at an inclined angle in the region where it crosses over the flow path area. This localized spatial arrangement provides routing freedom exactly where needed, allowing the flow path to maintain optimal configuration in critical areas while the wiring substrate adapts to the inclined positioning to avoid interference.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design ensures a larger area for flow path formation, enhancing the degree of freedom in flow path arrangement and reducing the overall size of the liquid ejecting head, while preventing interference with the flexible wiring substrate.

Implementation Method 1

the flexible wiring substrate is inclined in a direction directed toward a first surface side of both surfaces of the flexible wiring substrate. In an area on a second surface side of both surfaces of the flexible wiring substrate, the flow path has a portion extending along the liquid ejection surface.

Methodology Applied
Scientific EffectGeometric arrangement: Geometry

Data Source

PatentUS9789686B2Liquid ejecting head and liquid ejecting apparatus
Publication Date: 2017.10.17 SEIKO EPSON CORP
  • US9789686B2 patent drawing
  • US9789686B2 patent drawing
  • US9789686B2 patent drawing

AI summary

Provided is a liquid ejecting head which includes a head main body which has liquid ejection surface through which liquid is ejected, a flexible wiring substrate which is connected to the head main body, and a flow-path member having flow path through which liquid is supplied to the head main body. The flow-path member has an opening portion through which the substrate is inserted. The substrate extends to the flow-path member, with respect to the head main body. The substrate is inclined in a direction directed toward a first surface side of both surfaces of the substrate. In an area on a second surface side of both surfaces of the substrate, the flow path has a portion extending along the head main body.