Inclined Optical Surface Packaging With Anisotropic Wafer Etching
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Solution Overview
Problem
Existing methods for manufacturing component arrangements for packages, particularly those involving optical elements, face inefficiencies and quality issues regarding optical properties, such as light reflection, dispersion, and absorption.
Innovation Solution
A method involving anisotropic etching of semiconductor wafers to create inclined optical surfaces and mounting surfaces, allowing for the application of optical functional layers that enhance optical properties, including light reflection, dispersion, and polarization, and enabling efficient light redirection within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional methods are used to manufacture optical surfaces for component arrangements, then the manufacturing process is simpler, but the optical quality and efficiency are insufficient
Solution Approach 1:
The method performs preliminary actions by providing a semiconductor wafer with a pre-existing polished surface before the manufacturing process begins. This pre-polished surface serves as the foundation for subsequent anisotropic etching, eliminating the need for separate polishing steps and reducing overall manufacturing complexity while ensuring high optical quality from the outset
Solution Approach 2:
The invention replaces conventional mechanical polishing and coating methods with anisotropic etching of semiconductor wafers. This substitution of mechanical processes with chemical etching creates optically superior surfaces with precise control over reflectivity and light redirection properties, significantly improving optical surface quality
2Length of stationary object
If optical elements are arranged upright in packages, then the optical function is achieved, but the package height increases
Solution Approach 1:
The invention changes the orientation parameter of optical surfaces from vertical (upright) to inclined angles. By etching surfaces at specific angles relative to the wafer plane, the package can achieve the required optical function with reduced height, as light redirection occurs through the inclined surface geometry rather than requiring vertical element arrangement
Solution Approach 2:
The method transitions from arranging optical elements in a vertical dimension (upright arrangement) to utilizing inclined surfaces that operate in multiple dimensions. The anisotropically etched surfaces create three-dimensional light redirection pathways, allowing compact package design without compromising optical functionality
3Reliability
If anisotropic etching is used to create inclined optical surfaces, then optical performance is enhanced, but the manufacturing process becomes more complex
Solution Approach 1:
The semiconductor wafer serves multiple functions: it provides the substrate, the polished surface, and the anisotropically etched optical surfaces all in one component. This multi-functionality eliminates the need for separate optical elements and assembly steps, reducing overall manufacturing process complexity despite the advanced etching technique used
Solution Approach 2:
The invention merges the substrate and optical surface into a single integrated component. The anisotropic etching process directly creates the optical surface on the semiconductor wafer itself, combining what would traditionally be separate components (substrate + optical element) into one unified structure, simplifying the overall manufacturing process
4Manufacturing precision
If conventional mounting methods are used for component arrangements, then the assembly is simpler, but the mounting precision and alignment are insufficient
Solution Approach 1:
The method performs preliminary alignment by creating the inclined optical surface directly on the semiconductor wafer during the etching process itself. This pre-establishes the correct orientation and geometry, eliminating the need for complex post-assembly alignment operations and simplifying the mounting process while maintaining high precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the manufacturing efficiency and quality of optical surfaces, allowing for reduced package height, simplified mounting, and enhanced optical performance, including the ability to redirect light beams without requiring optical elements to be arranged upright, thus improving the overall performance and design of optical packages.
Implementation Method 1
forming an opening in the wafer by anisotropic etching
Data Source
AI summary
Provided is a method for manufacturing a component arrangement for a package, including providing a wafer made of a semiconductor material having a polished wafer surface; forming an opening in the wafer by anisotropic etching, wherein an anisotropically etched surface is manufactured near the opening; separating a component from the anisotropically etched wafer, wherein the separated component is manufactured having the following surfaces: an optical surface formed near a surface portion of the polished wafer surface and a mounting surface formed in the region of the anisotropically etched surface; and mounting the separated component on a substrate surface of a carrier substrate using the mounting surface in such a manner that the anisotropically etched surface is bonded to the substrate surface, wherein the optical surface is arranged as an inclined exposed surface. Furthermore, a component arrangement and a package are provided having a component arrangement.