Inclined PCB Antenna Assembly for Slim Millimeter-Wave Devices
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Solution Overview
Problem
Next-generation wireless communication technologies face challenges with high free space loss due to frequency characteristics, leading to decreased antenna radiation performance in slim electronic devices where antennas may overlap with metallic housing, especially when using millimeter waves above 20 GHz.
Innovation Solution
An antenna assembly is designed with antennas formed on an inclined side face of a printed circuit board (PCB), allowing for improved radiation patterns and reduced interference with the device's metallic housing, enhancing communication efficiency in slim form factors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If antennas are placed in slim electronic devices, then device thickness is reduced, but antenna radiation performance decreases due to overlap with metallic housing
Solution Approach 1:
The patent applies dimensionality change by transitioning antenna placement from traditional flat PCB surfaces to the three-dimensional inclined side surface of the PCB. This spatial reconfiguration allows antennas to radiate in directions away from the metallic housing, eliminating the performance degradation caused by proximity to conductive surfaces while maintaining slim device form factor.
Solution Approach 2:
The patent utilizes asymmetry by positioning antennas on inclined side surfaces rather than symmetric flat surfaces. The inclined orientation creates asymmetric radiation patterns that direct energy away from the metallic housing structure, improving radiation efficiency without increasing device thickness.
2Productivity
If millimeter wave frequencies are used, then network capacity and communication speed increase, but free space loss increases due to frequency characteristics
Solution Approach 1:
The patent applies parameter changes by modifying the physical orientation and placement parameters of antennas to match millimeter wave characteristics. The inclined side surface positioning optimizes radiation patterns for high-frequency operation, reducing free space loss through improved spatial distribution of electromagnetic energy while maintaining high network capacity.
Data Source
AI summary
An inclined antenna assembly and an electronic device including the antenna assembly are provided. The inclined antenna assembly and an electronic device include a communication circuit and a Printed Circuit Board (PCB) including a front face, a back face on which the communication circuit is disposed, and at least one side face having an inclined manner between the front face and the back face. According to various embodiments, the PCB may include one or more antennas formed on a region corresponding to at least one side face.