Inclined PCB Antenna Layout to Avoid Metal Housing Interference
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Solution Overview
Problem
Next-generation wireless communication technologies face challenges with high free space loss due to increased frequency, leading to decreased antenna radiation performance in slim electronic devices where antennas may overlap with metallic housing, causing performance degradation.
Innovation Solution
An antenna assembly is designed with antenna elements formed on an inclined side face of a printed circuit board (PCB), allowing for controlled beam direction and minimizing interference with the metallic housing, thereby enhancing radiation performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If antennas are disposed on a flat surface of the PCB, then the device structure is simple, but the radiation performance deteriorates due to overlap with metallic housing in slim devices
Solution Approach 1:
The patent transitions from a 2D flat antenna layout to a 3D inclined surface layout on the PCB. By forming the antenna on an inclined side face rather than a flat surface, the antenna achieves better spatial separation from the metallic housing, improving radiation performance without significantly increasing overall device complexity.
Solution Approach 2:
The patent employs an asymmetric inclined surface design where the antenna is positioned on a slanted face of the PCB rather than a symmetric flat surface. This asymmetric configuration allows the antenna to be oriented at an optimal angle relative to the metallic housing, reducing interference and improving radiation characteristics.
2Speed
If the frequency is increased for next-generation wireless communication, then the data communication speed is improved, but the free space loss increases causing decreased antenna radiation performance
Solution Approach 1:
The patent changes the geometric parameters of the antenna system by positioning it on an inclined surface with a specific angle range (30-60 degrees). This parameter change optimizes the radiation pattern and reduces free space loss at high frequencies, enabling next-generation wireless communication while maintaining radiation performance.
3Length of moving object
If the electronic device is made slimmer, then the device portability is improved, but the antenna overlap with metallic housing increases causing performance degradation
Solution Approach 1:
By utilizing the inclined side face of the PCB in the third dimension, the patent achieves effective antenna positioning that maintains radiation performance even in slim devices. The inclined orientation creates spatial separation from the metallic housing without increasing device thickness.
Solution Approach 2:
The patent employs an inclined angular surface rather than a flat plane, creating a curved or slanted configuration that allows the antenna to be positioned away from the metallic housing. This angular geometry effectively uses available space in slim device configurations.
Data Source
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Figure 3A
AI summary
An inclined antenna assembly and an electronic device including the antenna assembly are provided. The inclined antenna assembly and an electronic device include a communication circuit and a Printed Circuit Board (PCB) including a front face, a back face on which the communication circuit is disposed, and at least one side face having an inclined manner between the front face and the back face. According to various embodiments, the PCB may include one or more antennas formed on a region corresponding to at least one side face.