Inclined Pick Head Transfer Mechanism for IC Reorientation

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Solution Overview

Problem

The existing transfer mechanisms for semiconductor packages require an additional flipping mechanism to change their orientation, increasing the likelihood of damage and drop during handling.

Innovation Solution

A transfer apparatus with rotatable and inclined pick heads that utilize suction force to reorient integrated circuit packages by 90 degrees from a receiving surface to a test handler, eliminating the need for a separate flipping mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If an additional flipping mechanism is used to change package orientation, then the orientation can be changed, but the frequency of picking and placing increases, leading to higher likelihood of damage

Engineering Contradiction:

Improveorientation change capabilityVSAvoidpackage damage likelihood

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

The patent merges the orientation change function into the transfer mechanism itself. The inclined pick head is integrated into the transfer apparatus, allowing packages to be picked up and reoriented in a single continuous motion rather than requiring separate picking and flipping operations. This eliminates the need for additional flipping mechanisms and reduces handling frequency.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent introduces a dimensional change by using an inclined pick head at a specific angle (e.g., 45 degrees) relative to the receiving surface. This angular dimension enables the package to be picked up and reoriented during the transfer motion itself, transforming the orientation from vertical to upside-down position without requiring an additional flipping step.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Adaptability or versatility

If an additional flipping mechanism is used, then orientation can be changed, but the complexity of the device increases

Engineering Contradiction:

Improveorientation change capabilityVSAvoidnumber of mechanisms

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent combines multiple functions into a single mechanism. The inclined pick head simultaneously performs the functions of picking up the package, changing its orientation, and transferring it to the test handler. This integration eliminates the need for separate flipping mechanisms, reducing overall device complexity.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The transfer mechanism is designed with multi-functionality. The inclined pick head can pick up packages from the receiving surface, reorient them during transfer, and deliver them to the test handler in the desired orientation. This universal mechanism replaces what would otherwise require multiple specialized mechanisms.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The apparatus effectively changes the orientation of semiconductor packages without additional flipping, reducing the risk of damage and handling errors during transfer to subsequent processing stations.

Implementation Method 1

The transfer pick heads are coupled to and extendable from the rotary device to hold the IC packages during transfer using suction force

Methodology Applied

Scientific EffectSuction force: Suction

Implementation Method 2

The transfer pick heads are inclined at an angle with respect to the transfer apparatus axis. Such a configuration allows the transfer apparatus to change an orientation of the IC packages from the receiving surface on the wafer to a desired orientation before the IC packages are transferred to the rotary turret

Methodology Applied

Scientific EffectMechanical reorientation through inclined geometry: Inclined Plane

Data Source

PatentUS9218995B2Transfer apparatus for transferring electronic devices and changing their orientations

Publication Date: 2015.12.22 ASMPT SINGAPORE PTE LTD

AI summary

A transfer apparatus for transferring electronic devices from a wafer to a test handler. The transfer apparatus comprises: i) a rotary device rotatable about an axis; and ii) a plurality of holders configured to hold the electronic devices for transfer from the wafer to the test handler. The plurality of holders are coupled to, and extendable from, the rotary device to pick the electronic devices from the wafer. Specifically, the plurality of holders are arranged circumferentially around, and inclined with respect to, the axis of the rotary device, so as to change an orientation of the electronic devices on the wafer to a desired orientation of the electronic devices on the test handler.