Inclined Semiconductor Interface Reduces Optical Reflection
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Solution Overview
Problem
Conventional semiconductor optical function devices face issues with residual reflection at the end portion of optical waveguides, leading to reverse light interference, which causes instability in optical systems and reduces manufacturing yield due to non-flat optical amplification gain and variance in characteristics.
Innovation Solution
The semiconductor optical function device features a non-waveguide region with semiconductor interfaces inclined relative to the substrate edge surface by a specific angle, preventing reverse light from entering the optical waveguide and effectively reducing internal reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the semiconductor interface is inclined relative to the substrate edge surface, then internal reflection is reduced and optical system stability is improved, but manufacturing complexity increases due to the need for precise angle control
Solution Approach 1:
The invention changes the geometric parameter of the semiconductor interface from parallel to inclined at a specific angle (45-60 degrees) relative to the substrate edge surface. This parameter change effectively reduces internal reflection and improves optical system stability by redirecting reflected light away from the optical waveguide.
Solution Approach 2:
The invention introduces an inclined plane geometry at the semiconductor interface, creating an asymmetric angular structure rather than a flat parallel surface. This angular configuration modifies the reflection path of light, directing it away from the optical waveguide to reduce interference.
2Ease of manufacture
If the semiconductor interface is parallel to the substrate edge surface, then manufacturing is simpler, but reverse light interference occurs causing non-flat optical amplification gain
Solution Approach 1:
The invention changes the geometric parameter of the semiconductor interface from parallel to inclined at a specific angle (45-60 degrees) relative to the substrate edge surface. This parameter change effectively reduces internal reflection and improves optical system stability by redirecting reflected light away from the optical waveguide.
3Manufacturing precision
If the semiconductor interface is inclined at a specific angle, then manufacturing precision and optical gain consistency are improved, but device complexity increases
Solution Approach 1:
The invention changes the geometric parameter of the semiconductor interface from parallel to inclined at a specific angle (45-60 degrees) relative to the substrate edge surface. This parameter change effectively reduces internal reflection and improves optical system stability by redirecting reflected light away from the optical waveguide.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design significantly reduces internal reflection, stabilizes the optical system, and improves manufacturing yield by ensuring consistent optical amplification gain and modulation response properties.
Implementation Method 1
The semiconductor interface extends not in parallel to the substrate edge surface, and is inclined relative to the substrate edge surface by a specific angle... preventing reverse light from entering the optical waveguide and effectively reducing internal reflection
Data Source
AI summary
A semiconductor optical function device includes a semiconductor substrate having a substrate edge surface; an optical waveguide formed on the semiconductor substrate; a non-waveguide region formed on the semiconductor substrate between the optical waveguide and the substrate edge surface; and an insulation region disposed around the optical waveguide and having a semiconductor interface contacting with the non-waveguide region on a side of the substrate edge surface. The semiconductor interface extends not in parallel to the substrate edge surface, and is inclined relative to the substrate edge surface by a specific angle.


