Inclined Shielding Plate for Bubble Release in Plating
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Solution Overview
Problem
Conventional cup type plating apparatuses face issues with air bubbles remaining on the lower surface of the electric field shielding plate, which can inhibit its function and degrade the plating quality of substrates.
Innovation Solution
The plating apparatus incorporates an electric field shielding plate with an inclined surface on its lower surface, directing air bubbles to an unshielded region, thereby preventing their accumulation and maintaining the shielding function.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If an electric field shielding plate is arranged between the anode and substrate to suppress thickening of outer peripheral portion plating film, then plating uniformity is improved, but air bubbles remain on the lower surface of the shielding plate which inhibits its function and degrades plating quality
Solution Approach 1:
The invention introduces a new dimension by forming an inclined surface on the lower surface of the electric field shielding plate. This inclined surface creates a slope that directs air bubbles toward the unshielded region, effectively removing bubbles from the shielding plate surface without compromising the shielding function. The inclined surface adds a dimensional feature that utilizes gravity to control bubble movement.
Solution Approach 2:
The invention applies local quality by creating an inclined surface only on the lower surface of the electric field shielding plate, specifically in the region where air bubbles accumulate. This localized modification allows the shielding plate to maintain its electric field shielding function in most areas while having a special bubble-releasing structure at the critical lower surface region.
2Ease of manufacture
If a horizontal lower surface is used on the electric field shielding plate, then manufacturing is simple, but air bubbles accumulate and inhibit shielding function
Solution Approach 1:
The invention transitions from a horizontal two-dimensional surface to a three-dimensional inclined surface configuration. This dimensional change creates a slope that utilizes gravity to direct air bubbles toward the unshielded region, preventing bubble accumulation while maintaining manufacturing simplicity through a straightforward inclined surface geometry.
3Manufacturing precision
If the electric field shielding plate completely shields the electric field between anode and substrate, then plating uniformity is maximized, but air bubbles on the shielding plate surface completely inhibit its function
Solution Approach 1:
The invention segments the lower surface of the electric field shielding plate into two functional regions: a shielded region that maintains electric field shielding and an unshielded region that serves as a bubble collection zone. This segmentation allows the shielding plate to maintain its primary function while providing a dedicated area for air bubbles to be directed away from the shielding surface.
Solution Approach 2:
The invention converts the harmful effect of air bubbles into a beneficial mechanism by using the inclined surface to direct bubbles toward the unshielded region. The bubbles, which would normally be harmful, are now channeled to a specific location where they can be easily removed or have minimal impact on the shielding function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively releases air bubbles from the shielding plate, ensuring the electric field shielding function is not compromised, thus improving the plating quality by preventing bubble-induced defects.
Implementation Method 1
An inclined surface is disposed in a lower surface of the electric field shielding plate, the inclined surface being inclined with respect to a horizontal direction, the inclined surface being configured to release an air bubble existing on the lower surface of the electric field shielding plate to the unshielded region
Implementation Method 2
The electric field shielding plate is configured to be arranged in a portion between the anode and the substrate in an inside of the plating tank for shielding a part of an electric field formed between the anode and the substrate
Data Source
AI summary
Provided is a technique that can suppress remaining of air bubbles on a lower surface of an electric field shielding plate. A plating apparatus 1000 include a plating tank 10, a substrate holder 30, and an electric field shielding plate 60 configured to be arranged in a portion between an anode 50 and a substrate Wf in an inside of the plating tank for shielding a part of an electric field formed between the anode and the substrate. In a top view of the electric field shielding plate, in the inside of the plating tank, an unshielded region 70 that is without shielded by the electric field shielding plate is disposed. An inclined surface is disposed in a lower surface 61a of the electric field shielding plate, the inclined surface is inclined with respect to a horizontal direction and is configured to release an air bubble existing on the lower surface thereof to the unshielded region.