Inclined Solder Pad Geometry for Chip Mounting
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Solution Overview
Problem
Conventional electronic carrier boards using through hole technology face issues with large solder joints and space occupation, leading to potential short circuits due to misalignment of conductive bumps during reflow processes, which complicates fabrication and reduces product yield.
Innovation Solution
The electronic carrier board features oppositely inclined carrying surfaces on solder pads to securely mount conductive bumps, preventing adjacent bumps from joining and ensuring stable chip positioning, thereby preventing short circuits and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional parallel carrying surfaces are used on solder pads, then the fabrication process is simple, but adjacent conductive bumps may join together causing short circuits
Solution Approach 1:
The patent applies asymmetry by changing the carrying surfaces of adjacent solder pads from parallel to oppositely inclined configurations. This asymmetric design creates a V-shaped geometry that physically prevents adjacent conductive bumps from coming into contact during the reflow process, thereby eliminating short circuit risks while maintaining fabrication simplicity.
2Manufacturing precision
If chip positioning is not secured during reflow, then the mounting process is fast, but chip displacement causes misalignment of solder bumps and pads
Solution Approach 1:
The patent implements preliminary action by pre-configuring the solder pad carrying surfaces with opposite inclinations before the reflow process. This preliminary geometric configuration automatically guides and secures the chip positioning during reflow, ensuring precise alignment of solder bumps with pads without requiring additional positioning steps or slowing down the process.
3Volume of moving object
If through hole technology is used, then mechanical strength is high, but space occupation is large and solder joints are bulky
Solution Approach 1:
The patent applies parameter changes by transitioning from through-hole technology to surface mount technology with inclined carrying surfaces. This parameter change enables the use of much smaller conductive bumps and reduces the overall volume occupied on the carrier board, while the inclined surface geometry compensates for the reduced mechanical strength by providing better positioning and preventing bump collapse during reflow.
Data Source
AI summary
An electronic carrier board for a chip to be mounted thereon is provided, which includes a body and a plurality of solder pads. The solder pads have carrying surfaces for carrying the chip thereon through conductive bumps. The carrying surfaces of at least two solder pads are oppositely inclined with respect to each other, thereby preventing the conductive bumps mounted on the carrying surfaces from displacement and thereby further preventing two adjacent conductive bumps subject to displacement from coming into short-circuit contact.