Inclined Substrate Cleaning Flow for Faster Plating Rinse
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Solution Overview
Problem
Existing plating apparatuses face inefficiencies in substrate cleaning due to plating solution adhering to the surface, which remains until the substrate completes a full 360° rotation, prolonging the cleaning process.
Innovation Solution
A plating apparatus with a substrate holder that rotates and inclines, combined with a cleaning member that discharges cleaning liquid from a lower to an upper position on the inclined substrate, ensuring efficient cleaning by opposing the flow direction of the plating solution to the rotation direction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the cleaning liquid is discharged upward toward the substrate surface while rotating the substrate, then the plating solution adhered to the surface is washed away, but the cleaning time increases because the plating solution moves to the downstream side and is not washed away until the substrate completes a 360° rotation
Solution Approach 1:
The patent inverts the conventional cleaning approach by discharging the cleaning liquid downward from the substrate surface rather than upward. This reversal causes the cleaning liquid to flow along the substrate surface in the direction opposite to the rotation direction, preventing plating solution from moving to the downstream side and eliminating the need for complete 360° rotation to achieve thorough cleaning.
Solution Approach 2:
The patent utilizes the dynamic interaction between the rotating substrate and the downward-discharged cleaning liquid. By coordinating the rotation of the substrate with the downward flow of cleaning liquid, the system creates a dynamic cleaning action that effectively removes plating solution without requiring the substrate to complete a full rotation, thereby reducing cleaning time while maintaining cleaning quality.
2Productivity
If the substrate is cleaned by rotating it with cleaning nozzles disposed in the lower side, then the cleaning process can be continuous, but the plating solution partially moves to the downstream side and remains adhered to the surface
Solution Approach 1:
The patent reverses the cleaning liquid discharge direction from upward to downward. This inversion ensures that the cleaning liquid flows along the substrate surface in the opposite direction to rotation, preventing plating solution from migrating to the downstream side and ensuring complete removal of contaminants while maintaining continuous operation.
Solution Approach 2:
The patent applies cleaning liquid locally at different positions on the substrate surface during rotation. By discharging cleaning liquid downward at multiple points along the rotation path, the system ensures that each local region of the substrate receives adequate cleaning action, preventing downstream contamination while maintaining overall cleaning efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively cleans the substrate surface in a shorter time by preventing plating solution accumulation, reducing contamination, and enhancing cleaning efficiency.
Implementation Method 1
The substrate cleaning member is configured to discharge a cleaning liquid to the surface to be plated of the substrate rotated by the rotation mechanism from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate inclined by the inclination mechanism
Implementation Method 2
a substrate cleaning member for cleaning the surface to be plated of the substrate held by the substrate holder. The substrate cleaning member is configured to discharge a cleaning liquid to the surface to be plated of the substrate rotated by the rotation mechanism from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate inclined by the inclination mechanism
Data Source
AI summary
A substrate is efficiently cleaned.A plating module 400 includes: a plating tank 410 configured to accommodate a plating solution; a substrate holder 440 configured to hold a substrate Wf with a surface to be plated Wf-a facing downward; a rotation mechanism 446 configured to rotate the substrate holder 440; an inclination mechanism 447 configured to incline the substrate holder 440; and a substrate cleaning member 472 for cleaning the surface to be plated Wf-a of the substrate Wf held by the substrate holder 440. The substrate cleaning member 472 is configured to discharge a cleaning liquid to the surface to be plated Wf-a of the substrate Wf rotated by the rotation mechanism 446 from a position corresponding to a lower end toward a position corresponding to an upper end of the substrate Wf inclined by the inclination mechanism 447.