Inclined Substrate Cooling in Thermal Processing Chambers
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor manufacturing, uneven cooling of substrates during thermal processing can lead to particle generation and damage, as existing methods fail to ensure uniform cooling and efficient heat dissipation.
Innovation Solution
A thermal processing apparatus with a chamber, chuck pins that support and incline the substrate, a heater for heating, and fluid supply and discharge ports for controlled cooling, where the controller adjusts chuck pin heights and fluid flow to maintain the substrate at an incline for even cooling fluid distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is cooled using conventional methods, then cooling is achieved, but uneven cooling occurs leading to particle generation and substrate damage
Solution Approach 1:
The substrate is positioned at an inclined state rather than horizontally, creating asymmetric fluid flow patterns. The fluid supply port is positioned at the upper end and discharge port at the lower end, establishing a directional flow that ensures uniform cooling across the entire substrate surface, preventing thermal stress and particle generation
Solution Approach 2:
The chuck pin heights are dynamically adjusted to maintain the substrate at a precise inclined angle. The system actively controls the positioning of multiple chuck pins to ensure optimal fluid flow distribution and cooling uniformity throughout the processing cycle
2Productivity
If the substrate is cooled rapidly, then cooling efficiency is improved, but uneven cooling distribution causes substrate damage
Solution Approach 1:
The cooling system provides localized and differentiated cooling across the substrate surface by positioning the fluid supply port at the upper end and discharge port at the lower end. This creates optimized local flow conditions that ensure each region of the substrate receives appropriate cooling, maintaining both efficiency and substrate integrity
Solution Approach 2:
The controller monitors and adjusts the heights of multiple chuck pins to maintain optimal substrate inclination. This feedback mechanism ensures that the substrate remains at the precise angle needed for uniform fluid flow distribution, preventing localized overheating or excessive cooling that could damage the substrate
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution prevents substrate damage and particle generation by ensuring rapid and uniform cooling, maintaining substrate integrity during thermal processing.
Implementation Method 1
a heater configured to provide heat energy to the processing zone
Implementation Method 2
supplying a cooling fluid through the fluid supply port to the inclined substrate
Implementation Method 3
the substrate is maintained to be inclined... supplies a cooling fluid... to ensure rapid and uniform cooling
Data Source
AI summary
Proposed are thermal processing apparatus, thermal processing method, and substrate treatment equipment, in which particle generation and damage to a substrate in the cooling process of the substrate can be prevented. The thermal processing apparatus includes a chamber having a processing zone therein, a plurality of chuck pins configured to support a substrate and move up or down individually, a heater configured to provide heat energy to the processing zone, a fluid supply port configured to supply a fluid to the processing zone, a fluid discharge port configured to discharge the fluid remaining in the processing zone to the outside, and a controller configured to control a treatment process of the substrate.