Indane Bis-o-aminophenol Poly-o-hydroxyamides for Dielectric Films
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Solution Overview
Problem
The microelectronics industry faces challenges in developing dielectric materials that meet the demands of increasing processing speeds, complexity, and packing density while maintaining reliability and performance.
Innovation Solution
The development of dielectric film-forming compositions that include polymers with indane bis-o-aminophenol compounds as diamine monomers, which can be used to create poly-o-hydroxyamides suitable for photosensitive compositions, enabling the formation of fine patterns and high-resolution dielectric films.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional dielectric materials are used, then existing processing capabilities are maintained, but they cannot meet the demands of increasing processing speeds, complexity, and packing density
Solution Approach 1:
The patent modifies the chemical structure of diamine monomers by introducing indane bis-o-aminophenol compounds with specific substituents (R1-R5 groups) to create poly-o-hydroxyamides with tailored dielectric properties. This structural parameter change enables the material to meet evolving performance requirements for processing speeds and packing density while maintaining reliability
Solution Approach 2:
The invention creates composite dielectric materials by combining poly-o-hydroxyamides with photosensitive compositions and various functional additives. This composite approach achieves the necessary adaptability for high-speed processing and dense packing while maintaining the base material's reliability
2Manufacturing precision
If photosensitive compositions are formulated for high resolution, then fine pattern formation is achieved, but manufacturing complexity increases
Solution Approach 1:
The patent introduces specific functional groups and substituents at localized positions within the poly-o-hydroxyamide structure (indicated by R1-R5 parameters) to enhance photosensitivity and resolution in critical areas while keeping the overall polymer structure relatively simple and manufacturable
3Use of energy by moving object
If dielectric films are cured at low temperature, then energy consumption is reduced, but mechanical properties deteriorate
Solution Approach 1:
The patent modifies the chemical composition parameters of the dielectric film by incorporating indane bis-o-aminophenol-derived poly-o-hydroxyamides with specific molecular structures that enable low-temperature curing. This parameter change allows the film to achieve adequate mechanical properties at reduced curing temperatures, lowering energy consumption
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These compositions provide dielectric films with excellent mechanical properties, high resolution, and the ability to form heat-resistant polybenzoxazole films, meeting the stringent requirements of the microelectronics industry.
Implementation Method 1
Poly-o-hydroxyamides of the present disclosure can be used in photosensitive compositions to provide a positive tone wherein the photosensitive compositions are soluble in an aqueous alkaline solution, can form a fine pattern, and can achieve high resolution
Implementation Method 2
After photolithographic processing, the patterned layer is converted to a heat resistant polybenzoxazole film by application of additional heating
Data Source
AI summary
This disclosure describes highly soluble novel poly-o-hydroxyamides containing new indane bis-o-aminophenols, photosensitive compositions containing same, and methods and articles for use thereof.