Indane Maleimide Resin Composition for Low Dielectric and Moisture Resistance
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Solution Overview
Problem
Current maleimide resins used in electronic devices exhibit high water absorption and dielectric properties, which are not sufficiently low for high humidity environments and high-frequency applications, compromising their performance in electronic substrates.
Innovation Solution
A resin composition combining a maleimide compound with an indane structure and a hydrocarbon-based compound, represented by Formula (1), which reduces dielectric properties and water absorption while maintaining high glass transition temperature (Tg), enabling the production of prepregs, films, metal foils, metal-clad laminates, and wiring boards with improved thermal and dielectric performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If maleimide resin is used to achieve high heat resistance, then glass transition temperature is improved, but water absorption increases
Solution Approach 1:
The patent combines maleimide resin with specific hydrocarbon-based compounds (containing aromatic cyclic groups or aliphatic cyclic groups) to create a composite resin system. This composite approach allows the cured product to achieve both high glass transition temperature (heat resistance) and low water absorption by leveraging the complementary properties of the different resin components
Solution Approach 2:
The patent modifies the chemical structure parameters of the resin by selecting specific hydrocarbon-based compounds with particular molecular structures (Formula 1 with specific cyclic groups). By changing the chemical composition and structural parameters of the resin system, the cured product achieves optimized balance between heat resistance and moisture resistance
2Temperature
If maleimide resin is used to achieve high heat resistance, then glass transition temperature is improved, but dielectric properties worsen
Solution Approach 1:
The patent creates a composite resin system combining maleimide resin with specifically selected hydrocarbon-based compounds. This composite formulation achieves a balanced cured product that simultaneously provides high glass transition temperature and excellent dielectric properties (low dielectric constant and low dielectric loss tangent) required for high-frequency applications
Solution Approach 2:
The patent optimizes dielectric parameters by selecting hydrocarbon-based compounds with specific structural characteristics (aromatic or aliphatic cyclic groups as shown in Formula 1). This parameter optimization allows the cured resin to achieve both thermal performance and low dielectric loss for high-frequency signal transmission
Data Source
AI summary
An aspect of the present invention relates to a resin composition containing a maleimide compound (A) having an indane structure in the molecule and a hydrocarbon-based compound (B) represented by the following Formula (1). In Formula (1), X represents a hydrocarbon group having 6 or more carbon atoms and containing at least one selected from an aromatic cyclic group and an aliphatic cyclic group. n represents an integer from 1 to 10.