Indene-Modified Polyphenylene Ether Resin for IC Substrates
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Solution Overview
Problem
The use of polyphenylene ether resin in integrated circuits with reduced feature sizes leads to electrical leakage and heat generation due to its high parasitic resistance and capacitance, which existing technologies fail to adequately address.
Innovation Solution
A method is introduced to modify polyphenylene ether resin by mixing an indene oligomer and a benzene-based organic solvent, then adding a peroxide initiator to reduce its molecular weight, resulting in an indene oligomer-modified polyphenylene ether resin with improved interfacial adhesion and reduced dielectric constant and dielectric loss, which is used in laminated films and substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polyphenylene ether resin is used in integrated circuits with reduced feature size, then the resin provides structural support and insulation, but the parasitic resistance and capacitance cause electrical leakage and heat generation
Solution Approach 1:
The patent changes the molecular weight parameter of polyphenylene ether resin by modifying it with indene oligomers. This parameter change reduces the dielectric constant and dielectric loss of the resin, thereby reducing parasitic resistance and capacitance, which eliminates electrical leakage and heat generation while maintaining insulation performance
Solution Approach 2:
The patent creates a composite material system by combining polyphenylene ether resin with indene oligomers. This composite structure reduces the molecular weight and improves the dielectric properties of the resin, solving the electrical leakage and heat generation problems without compromising insulation functionality
2Strength
If polyphenylene ether resin is used, then the resin provides mechanical properties and heat resistance, but the large molecular weight causes poor solubility and compatibility with other resins
Solution Approach 1:
The patent changes the molecular weight parameter of polyphenylene ether resin through indene oligomer modification. This reduction in molecular weight dramatically improves solubility in common solvents and compatibility with other resins like epoxy, while the modified structure maintains the mechanical strength and heat resistance properties
Solution Approach 2:
The indene oligomers act as intermediaries that modify the polyphenylene ether resin structure. These oligomers improve the solubility and compatibility of the resin system without significantly compromising the mechanical properties and heat resistance provided by the polyphenylene ether backbone
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified resin reduces dielectric constant and dielectric loss, addressing the issues of electrical leakage and heat generation in integrated circuits, while maintaining good temperature resistance and processability.
Implementation Method 1
adding a peroxide initiator to the mixed solution and insulating to obtain an indene oligomer-modified polyphenylene ether resin
Implementation Method 2
adding a peroxide initiator to the mixed solution and insulating to obtain an indene oligomer-modified polyphenylene ether resin so as to reduce the molecular weight of the polyphenylene ether
Implementation Method 3
mixing an indene oligomer, a polyphenylene ether, and a benzene-based organic solvent and then heating and dissolving the same to obtain a mixed solution
Implementation Method 4
mixing an indene oligomer, a polyphenylene ether, and a benzene-based organic solvent and then heating and dissolving the same to obtain a mixed solution
Implementation Method 5
laminating the laminated film of the third aspect to at least part of the surface of the substrate, and performing vacuum hot pressing and curing to obtain the laminated film
Data Source
AI summary
The present disclosure provides a method for modifying a polyphenylene ether resin, a laminated film composite, a laminated film, and a substrate. The method for modifying a polyphenylene ether resin using an indene oligomer to reduce the molecular weight of the polyphenylene ether to obtain an indene oligomer-modified polyphenylene ether resin. The modified polyphenylene ether with a smaller molecular weight has a lower softening point and melting point, a better interfacial adhesion, and can be better adhered to a substrate of an integrated circuit. Meanwhile, because it has a lower dielectric constant and dielectric loss, the dielectric constant and dielectric loss of the substrate can be reduced, thereby solving the technical problem of electric leakage and heat generation caused when the existing polyphenylene ether resin is applied to an integrated circuit when the feature size of the integrated circuit is reduced.