Indene Resin Composition for Moisture-Stable Dielectric Performance
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Solution Overview
Problem
Existing resin materials used in electronic devices suffer from deteriorated dielectric properties due to moisture absorption, which is not adequately addressed by current compounds with indene ring structures.
Innovation Solution
A compound incorporating an indene ring, a vinylbenzyl group, and an aromatic ring-containing group of 6 or more carbon atoms without a polymerizable carbon-carbon double bond is introduced, which suppresses dielectric property deterioration due to moisture absorption, and enhances thermal expansion control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a resin with low dielectric constant and low dielectric loss tangent is used to reduce transmission loss, then dielectric properties are improved, but the resin suffers from dielectric property deterioration due to moisture absorption
Solution Approach 1:
The patent modifies the molecular structure of indene-based compounds by introducing specific aromatic ring-containing groups (with 6 or more carbon atoms and without polymerizable carbon-carbon double bonds) to change the physical and chemical parameters of the resin. This structural modification reduces moisture absorption while maintaining low dielectric constant and low dielectric loss tangent, thereby resolving the contradiction between dielectric performance and moisture resistance
Solution Approach 2:
The invention creates a composite molecular structure combining indene ring, vinylbenzyl group, and aromatic ring-containing group. This composite structure leverages the beneficial properties of each component: indene provides low dielectric properties, vinylbenzyl enables curability, and aromatic ring-containing group reduces moisture absorption, thus achieving both low transmission loss and moisture resistance
2Speed
If communication technology is developed to process large amount of data at high speed, then data processing capability is improved, but transmission loss increases due to high frequency operation
Solution Approach 1:
The patent develops resin compositions with optimized molecular structures that maintain stable dielectric properties across high frequency ranges. By changing the chemical structure to include aromatic ring-containing groups, the resin exhibits lower dielectric loss tangent at high frequencies, reducing transmission loss and enabling high-speed data processing
Data Source
AI summary
An embodiment relates to a compound including: an indene ring; a vinylbenzyl group; and an aromatic ring-containing group of 6 or more carbon atoms without a polymerizable carbon-carbon double bond, in which both of the vinylbenzyl group and the aromatic ring-containing group are directly bonded to the indene ring.