Independent Nozzle Layout for Uniform Substrate Drying
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Solution Overview
Problem
Conventional substrate processing apparatuses with integrated nozzles for chemical liquid and inert gas suffer from issues like the IPA drop phenomenon, limited drying range, and chemical liquid scattering, leading to defects and non-uniform drying on substrates.
Innovation Solution
A substrate processing apparatus with a nozzle unit featuring independently actuated nozzles for liquid and gas, allowing for separate movement and control of the chemical liquid supply nozzle and the inert gas nozzle, which can be positioned closer to the substrate center, expanding the drying range and preventing chemical liquid scattering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If an integrated nozzle is used for both chemical liquid supply and drying gas supply, then the device structure is simplified, but the chemical liquid supply nozzle inevitably waits above the substrate during the drying process causing IPA drop phenomenon and static electricity defects
Solution Approach 1:
The integrated nozzle is divided into two separate nozzles: a chemical liquid supply nozzle and a drying gas supply nozzle. This segmentation allows each nozzle to be independently controlled and positioned, eliminating the problem where the chemical liquid supply nozzle must wait above the substrate during drying, thus preventing IPA drop phenomenon and static electricity defects.
Solution Approach 2:
The chemical liquid supply nozzle is extracted from the integrated nozzle structure and positioned separately from the drying gas supply nozzle. This extraction allows the chemical liquid supply nozzle to be moved away from the substrate during the drying process, preventing droplet formation and static electricity issues while maintaining simplified overall device structure.
2Device complexity
If an integrated nozzle is used, then the device structure is simplified, but the ejection range of inert gas is limited so the gas cannot reach the edge area of the substrate on the opposite side
Solution Approach 1:
By segmenting the integrated nozzle into separate chemical liquid supply and drying gas supply nozzles, the drying gas supply nozzle can be independently positioned to achieve broader coverage. This allows the inert gas to reach edge areas of the substrate on the opposite side, expanding the drying coverage area without complicating the overall device structure.
3Device complexity
If the chemical liquid supply height is limited, then the nozzle structure is simplified, but the gas supply nozzle cannot be moved beyond the height limit reducing usable flow rate and inert gas atmosphere on substrate upper surface
Solution Approach 1:
The drying gas supply nozzle is extracted from the integrated nozzle structure, allowing it to be positioned independently beyond the height limits that constrain the chemical liquid supply nozzle. This enables the gas supply nozzle to deliver higher flow rates and create a more effective inert gas atmosphere on the substrate upper surface without complicating the positioning system.
4Device complexity
If an integrated nozzle is used, then the structure is simplified, but there is a risk of chemical liquid scattering from the chemical liquid supply nozzle to the gas supply nozzle
Solution Approach 1:
By segmenting the integrated nozzle into separate chemical liquid supply and drying gas supply nozzles, the spatial separation between the two nozzle outlets prevents chemical liquid from scattering onto the gas supply nozzle. This eliminates the contamination risk while maintaining a simplified overall device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents defects caused by the IPA drop phenomenon, enhances drying performance by expanding the drying range, and improves the overall quality of the liquid processing process by ensuring uniform drying and preventing chemical liquid scattering.
Implementation Method 1
a first nozzle (392) configured to eject a cleaning liquid onto a substrate (W)
Implementation Method 2
a second nozzle (394) configured to eject an inert gas onto the substrate (W) to dry the substrate (W)
Data Source
AI summary
Proposed are a substrate processing apparatus having improved substrate drying performance by separately providing a chemical liquid supply nozzle and a gas supply nozzle; and a substrate processing method.


