Indirect Cooling Plate for High-Density Device Testing
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Solution Overview
Problem
Existing cooling systems for electronic components in device testing apparatuses face challenges in reducing environmental impact due to the use of fluorine-based inert liquids, which are difficult to replace with less environmentally harmful alternatives.
Innovation Solution
A cooling plate design featuring a first and second plate with a flow path in between, where the cooling liquid flows through the path without direct contact with the electronic components, allowing for the use of water as the cooling liquid and reducing environmental load.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If immersion liquid cooling system with fluorine-based inert liquid is used, then excellent electrical insulating properties are achieved, but environmental load increases
Solution Approach 1:
The patent introduces a heat transfer plate as an intermediary between the cooling liquid and the electronic component. The cooling liquid flows through channels in the heat transfer plate, transferring heat to the plate which then conducts heat to the component. This mediator allows the use of water instead of fluorine-based liquids, maintaining thermal cooling effectiveness while eliminating the environmental harm of inert liquids.
Solution Approach 2:
The cooling system is segmented into distinct functional parts: the heat transfer plate with integrated cooling channels, the electronic component, and the cooling liquid circulation system. This segmentation allows the cooling liquid to be separated from direct contact with the component, enabling the use of environmentally friendly water while maintaining effective heat removal through the plate structure.
2Temperature
If direct contact cooling liquid system is used, then cooling effectiveness is improved, but environmental impact increases due to use of fluorine-based liquids
Solution Approach 1:
The heat transfer plate serves as a thermal intermediary that maintains effective heat transfer from the electronic component to the cooling liquid without requiring direct contact between the liquid and component. The plate's thermal conductivity ensures efficient heat removal while the liquid flows only through sealed channels, allowing substitution of harmful fluorine-based liquids with environmentally benign water.
3Productivity
If cooling plate thickness is reduced for high-density wiring board arrangement, then device density increases, but cooling performance may deteriorate
Solution Approach 1:
The cooling channels are designed to extend along the thickness dimension of the heat transfer plate rather than requiring increased lateral space. By utilizing the vertical dimension for channel placement and heat transfer, the system achieves effective cooling in a compact thickness, enabling high-density wiring board arrangement without sacrificing cooling performance.
Solution Approach 2:
The heat transfer plate incorporates locally optimized features such as varying channel depths, different thermal conductivity materials in specific regions, and enhanced heat dissipation structures at hot spots. These localized quality enhancements maintain effective cooling performance even as the overall plate thickness is reduced to accommodate higher device density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The indirect liquid cooling system effectively cools electronic components using water, reducing environmental impact while allowing for a thinner cooling plate design that enables high-density arrangement of wiring boards in the device testing apparatus.
Implementation Method 1
a cooling plate (60) that cools an electronic component (52) for testing mounted on a wiring board (51)
Implementation Method 2
an adhesive part (63) that bonds the first plate (61) and the second plate (62)
Data Source
AI summary
A cooling plate cools an electronic component for testing mounted on a wiring board used for testing a device under test (DUT), and includes: a first plate having a main surface having a first groove that forms a flow path through which a cooling liquid passes; a second plate disposed on the main surface of the first plate; and an adhesive part that bonds the first plate and the second plate.