Indirect Temperature Sensing Structure for High-Power Charging

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Solution Overview

Problem

Existing temperature measurement technologies face challenges in accurately and rapidly monitoring the temperature of high-power charging devices without damaging the measurement element, as contact methods are risky and non-contact methods suffer from high errors and slow response times.

Innovation Solution

A temperature measurement structure using a heat conduction medium that indirectly transfers temperature to a sensor, avoiding direct contact and improving accuracy by maintaining a thermal impedance value less than 12K·cm2/W and heat conduction time under 20 ms, ensuring real-time monitoring without damaging the sensor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If contact temperature measurement is used, then measurement accuracy is improved, but the temperature sensor may be damaged by high current

Engineering Contradiction:
Improvetemperature measurement accuracyVSAvoidsensor safety
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

A heat conduction medium is introduced as an intermediary between the measured object and the temperature sensor. The heat conduction medium conducts heat from the measured object to the sensor without allowing direct electrical contact, thus maintaining measurement accuracy while protecting the sensor from high current damage.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If non-contact temperature measurement is used, then sensor safety is improved, but measurement accuracy and response time deteriorate

Engineering Contradiction:
Improvesensor safetyVSAvoidtemperature measurement accuracy
Core Design Contradiction:
ReliabilityVSMeasurement precision

Solution Approach 1:

The heat conduction medium serves as a physical intermediary that enables near-contact measurement. It maintains sufficient proximity to the measured object for rapid heat conduction (response time under 20ms) while preventing direct contact, thus achieving both high measurement accuracy and sensor safety.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Reliability

If heat conduction medium is used, then sensor protection is achieved, but thermal impedance increases

Engineering Contradiction:
Improvesensor protectionVSAvoidthermal impedance
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The thermal conductivity parameter of the heat conduction medium is optimized to maintain thermal impedance below 12K·cm2/W. By selecting materials and designing structures with appropriate thermal conductivity, the system achieves effective sensor protection while minimizing temperature measurement errors caused by thermal resistance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables rapid and accurate real-time temperature monitoring of high-power charging devices, improving measurement accuracy to ±3K compared to non-contact methods and avoiding sensor damage, while maintaining a simple and reliable structure.

Implementation Method 1

the heat conduction medium conducts heat of the measured object to the temperature sensor in real time

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20240369419A1Temperature measurement structure, charging apparatus and motor vehicle
Publication Date: 2024.11.07 CHANGCHUN JETTY AUTOMOTIVE PARTS CORPORATION
  • US20240369419A1 patent drawing
  • US20240369419A1 patent drawing

AI summary

A temperature measurement structure, a charging apparatus and a motor vehicle. The temperature measurement structure includes a heat conduction medium (4), a temperature sensor (2) and a pressure supply mechanism, and the heat conduction medium (4) is mounted on the pressure supply mechanism, the pressure supply mechanism supplies pressure to make the heat conduction medium (4) in contact with a measure object (6) and the temperature sensor (2) respectively, and the temperature sensor (2) determines a temperature of the measured object (6) through a temperature of the heat conduction medium (4). The temperature of the measured object (6) is indirectly conducted to the temperature sensor (2) through the heat conduction medium (4), so that not only the temperature of the measured object (6) is monitored, but also a disruptive influence on the temperature sensor (2) is avoided.