Indium Lid Assembly for Stress-Reduced IC Package Cooling
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Solution Overview
Problem
The semiconductor industry faces challenges in achieving reliable and stress-reduced packaging of integrated circuit dies due to the formation of gold-containing intermetallic compounds (IMCs) during processing and usage, which can crack, and the need for smaller and more creative packaging techniques as demand for smaller electronic devices grows.
Innovation Solution
The integration of an indium heat dissipation structure into the lid, formed through a plating process, eliminates the need for gold-containing IMCs and includes gaps or recesses outside the die area to reduce stress, improving reliability by avoiding the formation of gold-containing IMCs and managing thermal expansion mismatch.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If gold-containing intermetallic compounds are used in packaging, then bonding strength is improved, but reliability deteriorates due to cracking during processing and usage
Solution Approach 1:
The patent extracts and removes gold-containing intermetallic compounds from the packaging structure, replacing them with alternative materials that do not form cracking-prone IMCs, thereby eliminating the source of reliability problems while maintaining bonding functionality
Solution Approach 2:
The patent changes the material composition parameters by substituting gold-based IMCs with alternative bonding materials, altering the chemical and physical properties of the intermetallic structure to prevent cracking while preserving bonding strength
2Volume of moving object
If packaging size is reduced to meet demand for smaller electronic devices, then device compactness is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges multiple packaging functions into a more integrated structure, combining die attachment, heat dissipation, and stress management functions into a unified packaging approach that reduces overall size while managing complexity through functional integration
Solution Approach 2:
The patent employs nested packaging structures where components are arranged in layered or embedded configurations, allowing compact integration of multiple elements within reduced volume while maintaining manufacturing feasibility through systematic nesting
3Ease of manufacture
If thermal expansion mismatch is not managed, then manufacturing process is simplified, but stress in packages increases
Solution Approach 1:
The patent changes the thermal properties of packaging materials by selecting materials with matched thermal expansion coefficients, thereby reducing thermal stress without significantly complicating the manufacturing process
Solution Approach 2:
The patent employs composite material structures that combine materials with complementary thermal expansion properties, creating a layered or hybrid structure that compensates for thermal mismatch and reduces overall package stress
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the reliability and reduces stress in integrated circuit packages by eliminating gold-containing IMCs and managing thermal expansion, leading to more reliable and efficient heat dissipation without the risk of cracking during processing and usage.
Implementation Method 1
an indium thermal interface material on a back-side of the back-side metal layer
Implementation Method 2
formed by a plating process on the lid and may comprise indium
Data Source
AI summary
In an embodiment, a device includes a package component including an integrated circuit die and conductive connectors connected to the integrated circuit die, the conductive connectors disposed at a front-side of the package component. The device also includes a back-side metal layer on a back-side of the package component. The device also includes an indium thermal interface material on a back-side of the back-side metal layer. The device also includes a lid on a back-side of the indium thermal interface material. The device also includes a package substrate connected to the conductive connectors, the lid being adhered to the package substrate.