Thermally Stable Indium Precursor for Low-Carbon ALD Thin Films

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Solution Overview

Problem

Existing indium compounds used as thin-film forming raw materials in ALD methods lack thermal stability, resulting in unsatisfactory quality of the obtained thin-films.

Innovation Solution

An indium compound with a specific structure, represented by general formula (I), is developed, which exhibits excellent thermal stability and is used in a CVD or ALD method to produce high-quality thin-films.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If conventional indium compounds are used as precursors in ALD or CVD methods, then the thin-film formation process can be carried out, but the thermal stability is poor resulting in unsatisfactory thin-film quality with high residual carbon content

Engineering Contradiction:
Improvethin-film qualityVSAvoidthermal stability of precursor
Core Design Contradiction:
Manufacturing precisionVSStability of the object's composition

Solution Approach 1:

The patent changes the chemical structure parameters of the indium compound precursor by introducing specific organic ligands with controlled carbon chain lengths and functional groups. This structural modification improves thermal stability while maintaining volatility, resolving the contradiction between precursor stability and film quality. The controlled parameter changes in molecular structure enable the precursor to withstand higher temperatures without decomposing, thereby reducing residual carbon in the thin-film.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent employs composite molecular structures combining indium center with specially designed organic ligands (such as amine, amide, or amino acid-based ligands). This composite approach creates a precursor that integrates both thermal stability from the robust ligand framework and reactivity needed for ALD/CVD processes, thereby producing high-quality thin-films with low carbon content while maintaining precursor stability.

Inventive Principle:
Principle #40Composite materials

2Manufacturing precision

If a precursor with high thermal stability is used, then thin-film quality improves with low residual carbon, but the precursor structure becomes more complex making synthesis and handling more difficult

Engineering Contradiction:
Improvethin-film qualityVSAvoidprecursor structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent applies local quality by designing ligands with specific functional groups at particular positions around the indium center. Rather than uniformly complicating the entire molecule, the design focuses thermal stability enhancement at critical sites (such as coordinating groups near the metal center) while keeping other portions simple. This localized approach achieves high film quality without excessive overall molecular complexity, facilitating manageable synthesis and handling.

Inventive Principle:
Principle #3Local quality

3Ease of manufacture

If the precursor structure is simplified for ease of manufacture, then synthesis becomes easier, but thermal stability decreases resulting in poor thin-film quality

Engineering Contradiction:
Improveprecursor synthesis easeVSAvoidthin-film quality
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent segments the precursor molecule into distinct functional modules: a stable indium coordination core and separable ligand components. This segmentation allows independent optimization of each module's properties. The core provides thermal stability, while ligands can be selected for ease of synthesis. This modular approach enables manufacturing ease through standardized ligand synthesis while maintaining overall precursor thermal stability for high-quality thin-film production.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The indium compound enables the formation of high-quality thin-films with a low residual carbon content, enhancing the thermal stability and quality of the films produced.

Implementation Method 1

a raw material gas obtained by vaporizing the thin-film forming raw material

Methodology Applied
Scientific EffectVaporization: Evaporation

Implementation Method 2

forming a thin-film containing an indium atom on a surface of a substrate through use of a raw material gas obtained by vaporizing the thin-film forming raw material

Methodology Applied
Scientific EffectChemical vapor deposition: Chemical Vapour Deposition

Data Source

PatentUS12559839B2Indium compound, thin-film forming raw material, thin film, and method of producing same
Publication Date: 2026.02.24 ADEKA CORP
  • US12559839B2 patent drawing
  • US12559839B2 patent drawing
  • US12559839B2 patent drawing

AI summary

Provided is an indium compound, which is represented by the following general formula (1):where R1 and R2 each independently represent, for example, an unsubstituted alkyl group having 1 to 5 carbon atoms, R3 and R4 each independently represent, for example, a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, and A represents a group represented by the following general formula (L-1) or (L-2):where R11, R12, R13, R14, R21 and R22 each independently represent, for example, a hydrogen atom or an unsubstituted alkyl group having 1 to 5 carbon atoms, and represents a bonding position with C in the general formula (1).