Inductance Assembly Cooling Integration

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Solution Overview

Problem

Existing electric machines with internal stator configurations face challenges in effectively managing heat dissipation and securely mounting inductance assemblies, particularly when carrying strong currents and requiring efficient cooling systems.

Innovation Solution

The inductance assembly is designed with semi-cylindrical body portions and central channels to be securely mounted within a cooling assembly, utilizing clips or wedge-shaped blocks to ensure proper contact and heat dissipation, and includes coils with leg portions and head portions configured to fit within these channels, along with a cooling assembly for efficient heat removal.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Power

If the inductance assembly is designed to carry strong currents, then the electrical performance is improved, but heat generation increases and requires more effective cooling

Engineering Contradiction:
Improvecurrent carrying capacityVSAvoidheat generation
Core Design Contradiction:
PowerVSTemperature

Solution Approach 1:

The patent converts the harmful heat generated by strong currents into a manageable thermal field by integrating cooling channels directly within the inductance assembly body. The cooling channels are positioned to maximize heat extraction from high-current regions, transforming the heat problem into an integrated thermal management solution where the heat generation and cooling systems work together as a unified design.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Solution Approach 2:

The patent introduces a cooling fluid as an intermediary medium to transfer heat away from the inductance coils. The cooling fluid circulates through channels embedded in the inductance assembly, acting as a thermal mediator that absorbs heat from the high-current carrying coils and transports it to external cooling systems, thereby managing temperature while maintaining high power capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If the inductance assembly is securely mounted in the cooling assembly, then the mounting reliability is improved, but the device complexity increases due to additional mounting components

Engineering Contradiction:
Improvemounting securityVSAvoidmounting structure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the mounting structure with the cooling assembly by integrating mounting features directly into the cooling assembly body. The cooling assembly includes built-in mounting surfaces and attachment mechanisms that simultaneously provide both cooling functionality and secure mounting, eliminating the need for separate mounting brackets or fastening systems and reducing overall device complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The cooling assembly is designed to perform multiple functions: it provides thermal management through cooling channels, serves as a structural support for the inductance assembly, and includes integrated mounting features for secure attachment. This multi-functional design reduces the number of separate components needed and simplifies the overall system architecture.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Temperature

If the cooling assembly is integrated with the inductance assembly, then the heat dissipation efficiency is improved, but the manufacturing complexity increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent segments the inductance assembly into modular components, with cooling channels integrated into specific sections of the assembly body. This segmentation allows different portions to be manufactured separately using appropriate processes, then assembled together, reducing the complexity of manufacturing the entire integrated structure in one operation while maintaining effective heat dissipation pathways.

Inventive Principle:
Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances the secure mounting and heat dissipation of inductance assemblies within electric machines, ensuring adequate operation even under high current conditions by effectively managing heat generated by the coils.

Implementation Method 1

The inductance assembly is designed with semi-cylindrical body portions and central channels to be securely mounted within a cooling assembly... ensuring adequate operation even under high current conditions by effectively managing heat generated by the coils

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The cooling assembly for efficient heat removal... effectively managing heat generated by the coils

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS7423507B2Inductance assembly for an electric machine
Publication Date: 2008.09.09 DANA TM4 INC
  • US7423507B2 patent drawing
  • US7423507B2 patent drawing
  • US7423507B2 patent drawing

AI summary

The present invention is generally concerned with an inductance assembly that is so configured and sized as to be inserted inside the cooling assembly of an electric machine to thereby decrease the overall volume of the machine.