Inductance Device With Segmented Coil Substrates
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Solution Overview
Problem
Current methods for integrating inductive components with integrated circuits face challenges in achieving high electrical values in a restricted space while minimizing interference, particularly due to limitations in aspect ratio and the difficulty of integrating magnetic materials.
Innovation Solution
The solution involves forming a coil with conductive turns on separate substrates, allowing for adjustable inductance values by varying the thickness of the conductive connections between them, which can be filled with magnetic material to enhance inductance, thereby overcoming manufacturing constraints and achieving high inductance values without adding constraints to the integrated circuit.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through silicon vias (TSV) are used to connect metal traces forming coil turns, then electrical connections between traces are achieved, but the aspect ratio limits the thickness of the substrate or imposes substantial space between adjacent turns
Solution Approach 1:
The coil structure is segmented into two separate substrates, with first portions of turns on a first substrate and second portions of turns on a second substrate. This segmentation allows each substrate to be optimized independently, avoiding the aspect ratio constraints of single-substrate TSV implementations while maintaining reliable electrical connections through conductive connections in the interstitial space.
Solution Approach 2:
The invention transitions from a single-substrate vertical integration approach to a multi-substrate approach where coil turns are distributed across different substrates. The conductive connections extend into the interstitial space between substrates, utilizing the third dimension (space between substrates) to achieve electrical connections without being constrained by substrate thickness or creating large gaps between turns.
2Reliability
If magnetic material is integrated into the coil turns to increase inductance, then high inductance values are achieved, but integration difficulty increases substantially
Solution Approach 1:
The coil structure is divided into portions on separate substrates, allowing magnetic material to be integrated independently on each substrate or in the interstitial space between substrates. This segmentation simplifies manufacturing compared to attempting to integrate magnetic material throughout a single complex TSV structure, as each substrate can be processed separately with standard magnetic material deposition techniques.
3Adaptability or versatility
If full integration of inductive component with integrated circuit is implemented, then integration level is maximized, but the substrate thickness and space constraints limit inductance adjustment flexibility
Solution Approach 1:
The invention enables dynamic adjustment of inductance values by varying the thickness of conductive connections between the first and second substrates. Since the substrates are separate, the interstitial space and connection thickness can be controlled independently to achieve different inductance values without being constrained by a fixed substrate thickness, providing manufacturing flexibility while maintaining high integration levels.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for flexible adjustment of inductance values and achieves high inductance without the limitations of traditional integration methods, enabling closer integration of passive components with integrated circuits while maintaining a high level of integration.
Implementation Method 1
the conductive connection extending at least into an interstitial space located between the first face of the first substrate and the first face of the second substrate
Implementation Method 2
The space can be filled with a magnetic material intended to increase the value of the inductance
Data Source
AI summary
An inductance device includes a coil provided with at least one electrically conductive turn having a first portion of turn formed on a face of a first substrate, and a second portion of turn. A first end of the first portion is electrically connected to a first end of the second portion by a conductive connection, and the coil has a longitudinal axis, around which the at least one turn is formed, which is perpendicular to a dimension in thickness of the first substrate. The second portion is formed on a face of a second substrate different from the first substrate, with the face of the first substrate facing the face of the second substrate, with the conductive connection extending into an interstitial space located between the face of the first substrate and the face of the second substrate.