Electromagnetic Induction Coil Thermal Management via Air Gaps

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Solution Overview

Problem

Existing electromagnetic induction apparatuses face challenges in downsizing and efficient heat radiation due to increased thermal resistance from insulators and higher costs and size due to metal case housing with heat radiating resin.

Innovation Solution

The apparatus features coil portions with wiring patterns on a printed wiring board and metal members connected to these patterns, arranged side by side to form a coil body, allowing for efficient heat radiation and reduced thermal resistance without the need for a metal case filled with heat radiating resin.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If windings are wound in a multilayer structure with insulators between layers, then the degree of coupling between windings is improved and downsizing is enabled, but the heat radiating property degrades due to additional thermal resistance of insulators

Engineering Contradiction:
Improvetransformer sizeVSAvoidheat radiating property
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The patent extracts the insulator material from between the windings, replacing it with air gaps. This removes the thermal resistance barrier while maintaining the multilayer winding structure's compactness and coupling benefits.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent introduces air gaps (porous structure) between the windings instead of solid insulator material. This porous configuration reduces thermal resistance to heat radiation while preserving the electrical insulation and mechanical structure needed for downsizing.

Inventive Principle:
Principle #31Porous materials

2Temperature

If a reactor main body is housed inside a metal case filled with heat radiating resin, then heat radiation from the coil is improved, but costs and size are inevitably increased

Engineering Contradiction:
Improveheat radiation efficiencyVSAvoidreactor size
Core Design Contradiction:
TemperatureVSVolume of moving object

Solution Approach 1:

The patent removes the metal case and heat radiating resin entirely, replacing them with direct air-gap-based heat radiation pathways between windings and the core, eliminating the bulky housing while maintaining heat radiation efficiency.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The winding structure itself serves the dual function of electrical conduction and heat radiation through the air gaps, eliminating the need for separate heat radiation components like metal cases and resin fillers.

Inventive Principle:
Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enables reduced thermal resistance, downsizing, weight reduction, and cost savings while maintaining stable electrical characteristics and suppressing variations in inductance and loss.

Implementation Method 1

electromagnetic induction apparatus to be incorporated into, for example, a power converter

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

heat can be efficiently radiated from the coil body to enable reduction of the thermal resistance

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentEP3067903B1Electromagnetic induction apparatus
Publication Date: 2021.04.28 MITSUBISHI ELECTRIC CORP
  • EP3067903B1 patent drawingFigure 1
  • EP3067903B1 patent drawingFigure 2
  • EP3067903B1 patent drawingFigure 3

AI summary

In an electromagnetic induction apparatus, coil portions, each including a wiring pattern on a printed wiring board and a metal member having both end portions connected to the wiring pattern, are electrically connected to each other and arranged side by side to form a coil body. Therefore, for example, by mounting cooling means onto the printed wiring board, heat can be efficiently radiated from the coil body to enable reduction in thermal resistance.