Induction Coil Bonding for Faster Semiconductor Chip Soldering
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Solution Overview
Problem
The existing semiconductor package manufacturing process is hindered by the lengthy heating and cooling times associated with heat transfer-based soldering methods, which negatively impact productivity.
Innovation Solution
A bonding apparatus utilizing an induction heating system with a first induction coil and alternating current supply to induce a magnetic field, allowing for rapid and sequential heating of junctions between semiconductor chips and substrates through a transferring unit that moves the coil along a designated path, enhancing productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If heat transfer by conduction method is used for soldering, then the soldering process can be performed, but the heating and cooling time becomes long
Solution Approach 1:
The patent replaces the mechanical heat transfer system (heater embedded in tool) with an electromagnetic induction heating system. The induction heating coil generates a magnetic field that directly induces eddy currents in the solder bump, heating it rapidly without requiring prolonged contact with a heated tool. This substitution of heating mechanism dramatically reduces heating and cooling time while maintaining soldering quality.
Solution Approach 2:
The patent changes the heating method from conductive heat transfer to induction heating, fundamentally altering the thermal process parameters. The induction heating system allows for rapid temperature changes by controlling the alternating current frequency and intensity in the heating coil, enabling quick heating and cooling cycles that were not achievable with conventional conduction-based heating.
2Reliability
If multiple semiconductor chips are processed sequentially with conventional heating, then each chip can be soldered, but the overall productivity remains low
Solution Approach 1:
The patent divides the heating function into multiple independent induction heating coils, with each coil corresponding to a specific processing unit. This segmentation allows each unit to be heated independently and simultaneously, enabling parallel processing of multiple semiconductor chips without interfering with each other, thereby significantly increasing manufacturing throughput while maintaining consistent soldering quality.
Solution Approach 2:
The patent combines multiple processing units (each consisting of holder, semiconductor chip, substrate, and induction heating coil) into a single integrated system. The holders are arranged in adjacent spaced-apart relationships, and all units share common control systems and coordinate their operations, enabling synchronized parallel processing that improves productivity while maintaining individual unit reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The induction heating method significantly reduces the time required for soldering, thereby improving the overall productivity of the semiconductor package manufacturing process while maintaining precise alignment and minimizing warpage defects.
Implementation Method 1
an induction heating system having a first induction coil and a first alternating current supplying unit configured to apply an alternating current to the first induction coil, wherein the induction heating system is configured to heat the junction between the substrate and the semiconductor chip at each of the plurality of units by inducing a magnetic field around the first induction coil
Implementation Method 2
the induction heating system is configured to heat the junction between the substrate and the semiconductor chip at each of the plurality of units by inducing a magnetic field around the first induction coil
Data Source
AI summary
A bonding apparatus includes a plurality of units each having a first holder configured to support a substrate and a second holder above the first holder that is configured to mount a semiconductor chip on the substrate. The plurality of units are arranged in adjacent spaced apart relationship along a first direction. An induction heating system includes an induction coil and an alternating current supplying unit configured to apply an alternating current to the induction coil so as to heat a junction between a substrate and a semiconductor chip at each of the plurality of units by inducing a magnetic field around the induction coil. A transferring unit is configured to position the induction coil adjacent to each of the plurality of units, and the induction heating system is configured to sequentially heat the junction between a substrate and semiconductor chip at each of the plurality of units.