Induction Coil Carrier Heat Dissipation for Lower Electrical Losses
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Solution Overview
Problem
Existing induction cookers face inefficiencies in heat dissipation and material usage, leading to increased electrical losses and higher operating temperatures, which affect energy and material costs.
Innovation Solution
The induction cooking appliance incorporates a coil carrier with a heat dissipation unit designed to efficiently dissipate heat from the induction coil, featuring fin-shaped elements and a coating with high thermal conductivity, manufactured in a single piece for improved heat transfer and reduced material costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional mounting devices with mica paper, fiberglass cloth, and ceramic paper are used to attach the induction coil, then the coil can be mounted, but heat dissipation is insufficient leading to increased operating temperature and electrical losses
Solution Approach 1:
The heat dissipation unit is segmented into multiple fin-shaped elements that increase the surface area for heat dissipation. These fins divide the heat dissipation function into multiple parallel pathways, allowing more efficient heat transfer from the coil to the surrounding environment, thereby reducing operating temperature and electrical losses.
Solution Approach 2:
The heat dissipation unit extends in the vertical dimension below the coil carrier, creating a three-dimensional heat dissipation structure. This dimensional extension provides additional surface area for heat dissipation without increasing the horizontal footprint, effectively cooling the coil through enhanced thermal conduction and convection in the vertical space.
2Power
If the number of turns in the induction coil is increased to maintain electrical power, then electrical power output can be maintained, but material costs increase
Solution Approach 1:
The heat dissipation unit converts the harmful heat generated by the coil into a beneficial cooling effect. By efficiently dissipating heat, the unit allows the coil to operate at lower temperatures, which reduces electrical resistance and power losses. This enables the use of fewer coil turns while maintaining the same electrical power output, thereby reducing material costs.
3Power
If copper coils are used instead of aluminum coils, then electrical conductivity is improved, but material costs increase significantly
Solution Approach 1:
The heat dissipation unit changes the thermal parameter of the system by providing enhanced cooling. This thermal parameter change compensates for the lower electrical conductivity of aluminum compared to copper. By maintaining lower operating temperatures, the aluminum coil's electrical resistance is reduced, allowing aluminum to replace copper without significant power loss, thereby reducing material costs.
4Loss of energy
If a heat dissipation unit with high thermal conductivity materials is used, then heat dissipation efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The heat dissipation unit utilizes composite material construction, combining materials with different properties to achieve optimal heat dissipation. The fin-shaped elements may use materials with high thermal conductivity for heat transfer, while the overall structure is designed for ease of manufacturing. This composite approach allows the unit to achieve high heat dissipation efficiency while remaining manufacturable through standard processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces electrical losses, lowers operating temperatures, increases electrical power output, and decreases material costs by enhancing heat dissipation and using materials like polyphenylene sulfide (PPS) with high thermal conductivity.
Implementation Method 1
heat is transferred to dissipate the heat emitted by the induction coil by means of thermal conduction
Implementation Method 2
heat is transferred to dissipate the heat emitted by the induction coil by means of thermal conduction. Alternatively or additionally, it is conceivable that the heat is transferred to dissipate the heat emitted by the induction coil by means of thermal radiation and/or convection
Implementation Method 3
the heat dissipation unit has at least one fin-shaped first heat dissipation element... The increased surface area of the heat dissipation unit allows for particularly efficient heat transfer to the air surrounding the heat dissipation unit
Data Source
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AI summary
The invention relates to an induction cooking device (10), in particular an induction hob device, comprising at least one coil carrier (12) for holding at least one induction coil (14). According to the invention, in order to provide a generic induction cooking device with improved properties in terms of efficiency, the coil carrier (12) has a heat dissipation unit (16), which is provided for dissipating heat emitted by the induction coil (14).