Induction Coil Matrix for Uniform Master Substrate Heating
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Solution Overview
Problem
Existing imprinting processes face challenges in achieving uniform heating of master substrates with varying sizes using induction heating coils, leading to non-uniform temperature distribution and reduced precision in the imprinting process.
Innovation Solution
The proposed imprinting apparatus features a matrix arrangement of coil cores with adjustable positions and AC power supply controlled by temperature sensors to ensure uniform heating of the master substrate, allowing for flexible handling of substrates of different sizes and reducing pressure requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single coil is used to heat the master substrate, then the device structure is simple, but the temperature distribution becomes non-uniform when substrate size varies
Solution Approach 1:
The single coil is divided into multiple independent coil segments (first coil, second coil, third coil, fourth coil) arranged in a matrix pattern. Each coil segment can be independently controlled to heat different regions of the master substrate, ensuring uniform temperature distribution across substrates of various sizes while maintaining manageable structural complexity.
2Device complexity
If the coil is fixed in position, then the device structure is simple, but it cannot accommodate master substrates of various sizes
Solution Approach 1:
The coil segments are made movable along guide rails through a positioning mechanism involving support bars, guide members with screw patterns, and fixing members. This dynamic positioning capability allows the coil assembly to adapt to master substrates of various sizes while maintaining a relatively simple overall device structure.
3Force
If high pressure is applied during imprinting, then the imprinting force is sufficient, but the heating efficiency decreases due to heat loss
Solution Approach 1:
The master substrate is heated to the required temperature before the imprinting process begins. This preliminary heating action ensures that the substrate reaches optimal temperature for imprinting without requiring excessive pressure during the actual imprinting step, thereby reducing energy loss while maintaining sufficient imprinting force.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables high-precision imprinting with reduced defect rates and increased process speed by uniformly heating the master substrate, accommodating various substrate sizes and improving the overall convenience of the process.
Implementation Method 1
heating the metal coating layer of the master substrate by providing AC power to the plurality of coil lines
Implementation Method 2
a fine pattern is also heated through a magnetic field formed in a coil
Data Source
AI summary
This application relates to an imprinting apparatus and method. In one aspect, the imprinting apparatus applies pressure between a master substrate and a polymer film to transfer a pattern formed on the master substrate to the polymer film. The imprinting apparatus includes a plurality of coils and the surface of the master substrate is heated by an electromagnetic field induced by the plurality of coils. Through holes are defined in each of the plurality of coils, and support bars are inserted into the through holes. The positions of the plurality of coils are changed corresponding to the master substrate.