Induction Coil Mount Dynamic Distance Adaptation
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Solution Overview
Problem
Induction cooking devices face challenges in simplifying control algorithms due to varying ferromagnetic properties of cooking vessels, leading to irregular current flows and overheating in semiconductors, which require complex computations to optimize power transfer.
Innovation Solution
A dynamic coil mount that adjusts the distance between the induction coil and the cooking surface based on the temperature of the coil and driving circuit components, increasing the distance with rising temperature to reduce impedance and regularize current flow, thereby reducing semiconductor temperature without complex control algorithms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If complex control algorithms are used to adapt to different cooking vessels, then power transfer optimization is improved, but device complexity increases
Solution Approach 1:
The patent extracts the complex control algorithms from the system and replaces them with a passive mechanical distance adaptation mechanism. The coil mount automatically adjusts the distance between the induction coil and cooking surface based on temperature feedback, eliminating the need for complex computational control while maintaining power transfer optimization.
Solution Approach 2:
The system implements self-service through automatic temperature-based distance adjustment. The coil mount continuously monitors temperature and autonomously adjusts the coil position to optimize power transfer, without requiring external control algorithms or user intervention.
2Device complexity
If the distance between induction coil and cooking surface is fixed, then device simplicity is maintained, but temperature regulation and current flow stability deteriorate
Solution Approach 1:
The patent transforms the fixed distance mechanical structure into a dynamic adjustment mechanism. The coil mount can continuously vary the distance between the induction coil and cooking surface based on real-time temperature conditions, enabling automatic temperature regulation while maintaining relative mechanical simplicity.
Solution Approach 2:
The system implements feedback control where temperature sensors monitor the induction coil temperature and feed this information back to the coil mount, which then adjusts the distance accordingly. This closed-loop feedback mechanism achieves temperature regulation without complex control algorithms.
3Temperature
If distance adjustment mechanism is added to regulate temperature, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent introduces a passive thermal intermediary mechanism where temperature-sensitive materials or thermal expansion elements automatically adjust the coil distance in response to temperature changes. This intermediary mechanism provides temperature control while avoiding complex active control systems.
Solution Approach 2:
The system changes physical parameters such as thermal expansion coefficients or material phase transitions to automatically adjust the coil distance. By utilizing inherent material property changes with temperature, the system achieves temperature control without adding complex mechanical or electronic control components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This mechanical solution effectively regulates the temperature of the induction coil and driving circuit, reducing current irregularities and semiconductor overheating, allowing for efficient heating without complex control adaptations for different cooking vessels.
Implementation Method 1
an alternating field may be generated with the induction coil. The varying magnetic field will then induce a current flow in the bottom surface of the cooking vessel. The current flow will generate heat in the bottom of the cooking vessel
Implementation Method 2
the coil mount is configured to dynamically adapt the distance between the induction coil and the cooking surface based on a temperature of the induction coil and/or at least a component of the driving circuit, wherein the coil mount is configured to increase the distance between the induction coil and the cooking surface with increasing temperature
Data Source
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AI summary
The present invention provides an induction cooking device (100, 200, 300) for heating a cooking vessel (150, 250, 350), the induction cooking device (100, 200, 300) comprising a cooking surface (101, 201, 301 ) comprising a cooking hob (106), an induction coil (102, 202, 302), a driving circuit (103, 203, 303) electrically coupled to the induction coil (102, 202, 302), and a coil mount (105) that is arranged under cooking hob (106), wherein the induction coil (102, 202, 302) is arranged on the coil mount (105) and wherein the coil mount (105) is configured to dynamically adapt the distance between the induction coil (102, 202, 302) and the cooking surface (101, 201, 301) based on a temperature of the induction coil (102, 202, 302) and/or at least a component of the driving circuit (103, 203, 303), wherein the coil mount (105) is configured to increase the distance between the induction coil (102, 202, 302) and the cooking surface (101, 201, 301 ) with increasing temperature of the induction coil (102, 202, 302) and/or the at least one component of the driving circuit (103, 203, 303). Further, the present invention provides a respective method.