Induction Coil for Semiconductor Solder Ball Reflow

Solution Overview

Problem

Existing semiconductor chip packaging processes face challenges in efficiently reflowing solder balls using conventional heating methods, which can lead to thermal deformation of conductive lines and uneven heating of solder balls.

Innovation Solution

A coil-based package apparatus is designed for induction heating, featuring a unique structure with inclined surfaces and multiple bottom portions of varying lengths to selectively heat solder balls, reducing thermal deformation and ensuring uniform heating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional heating methods are used to reflow solder balls, then heating can be applied to the solder balls, but thermal deformation of conductive lines occurs and heating uniformity is poor

Engineering Contradiction:

Improveheating temperatureVSAvoidheating uniformity

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The coil is divided into multiple independent winding sections, each capable of being controlled separately. This segmentation allows different regions of the coil to heat different areas of the solder balls independently, achieving uniform heating across all solder balls while preventing thermal deformation of conductive lines through localized temperature control

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different winding sections of the coil are designed with varying characteristics to provide localized heating zones. Each section can be optimized for specific heating requirements of different solder ball positions, ensuring that each solder ball receives appropriate heat treatment without affecting adjacent areas excessively

Inventive Principle:

Principle #3Local quality

2Temperature

If conventional heating methods are used to reflow solder balls, then heating can be applied to the solder balls, but thermal deformation of conductive lines occurs

Engineering Contradiction:

Improveheating temperatureVSAvoidthermal deformation

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The coil is divided into multiple independent winding sections, each capable of being controlled separately. This segmentation allows different regions of the coil to heat different areas of the solder balls independently, achieving uniform heating across all solder balls while preventing thermal deformation of conductive lines through localized temperature control

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heating system applies heat selectively to only the areas requiring reflow through controlled activation of specific winding sections. By limiting heat application to necessary zones and controlling temperature profiles, the system achieves effective solder ball heating while minimizing excessive thermal exposure that would cause conductive line deformation

Inventive Principle:

Principle #16Partial or excessive action

3Ease of manufacture

If a simple coil structure is used, then manufacturing is easier, but heating uniformity of solder balls is poor

Engineering Contradiction:

Improvecoil manufacturingVSAvoidheating uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The coil is divided into multiple independent winding sections, each capable of being controlled separately. This segmentation allows different regions of the coil to heat different areas of the solder balls independently, achieving uniform heating across all solder balls while preventing thermal deformation of conductive lines through localized temperature control

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The multi-section coil structure serves multiple functions: it provides uniform heating across all solder balls, enables selective heating of specific areas, allows independent temperature control for each section, and maintains a relatively simple overall construction that is feasible to manufacture

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The coil apparatus efficiently reflows solder balls while minimizing thermal deformation of conductive lines, ensuring high-temperature heating of semiconductor chips with improved uniformity and processing speed.

Implementation Method 1

a coil-based package apparatus to package a semiconductor chip, which is adapted for induction heating of a solder ball

Methodology Applied

Scientific EffectInduction heating: Induction Heating

Data Source

PatentUS8420989B2Coil and semiconductor apparatus having the same

Publication Date: 2013.04.16 SAMSUNG ELECTRONICS CO LTD

AI summary

An apparatus to package a semiconductor chip includes a coil configured to use induction heating to reflow a solder ball of the semiconductor chip. The coil includes a first body, a second body parallel to the first body, a third body extending from the first body to the second body. The first and second bodies are symmetrical with respect to a vertical plane disposed therebetween. The first and second bodies have inclined surfaces facing each other, and the inclined surfaces are distant from each other downward.