Induction Coil Positioning for Cooking Vessel Coupling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing induction cooking devices face challenges in optimizing the coupling between the cooking vessel and the induction coil, leading to inefficiencies in energy transfer due to varying magnetic properties and spatial overlap, which increases complexity and material requirements.
Innovation Solution
An induction cooking device with a dynamically adjustable induction coil mount that adapts the position of the induction coil in a plane parallel to the cooking surface based on the determined power level, optimizing the spatial overlap and magnetic coupling without the need for complex multi-coil designs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple induction coils are provided for every single hob to improve coupling with different cooking vessels, then the magnetic coupling and energy transfer efficiency are improved, but the device complexity and material requirements drastically increase
Solution Approach 1:
The patent applies the dynamics principle by making the induction coil position adjustable rather than fixed. The coil can be dynamically repositioned along the hob surface to achieve optimal spatial overlap with different cooking vessel configurations. This single adjustable coil replaces the need for multiple fixed coils, maintaining reliable magnetic coupling while reducing device complexity.
2Productivity
If multiple induction coils are provided for every single hob to improve spatial overlap with cooking vessels, then the energy transfer efficiency is improved, but the material requirements and device complexity drastically increase
Solution Approach 1:
The patent implements a dynamically adjustable coil position system that allows a single induction coil to be repositioned to match various cooking vessel sizes and positions. This dynamic adjustment capability enables efficient energy transfer for different vessel types without requiring multiple coils, thereby maintaining productivity while reducing device complexity.
3Device complexity
If a single induction coil is used for the hob, then the device complexity is reduced, but the coupling factor and energy transfer efficiency decrease due to varying spatial overlap with different cooking vessels
Solution Approach 1:
The patent resolves this contradiction by introducing dynamic adjustability to the single coil system. The coil can be repositioned along the hob to achieve optimal alignment with different cooking vessels, maintaining a high coupling factor while keeping the device complexity low through the use of a single coil rather than multiple coils.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances the magnetic coupling between the cooking vessel and the induction coil, ensuring efficient energy transfer and maintaining low device complexity by dynamically adjusting the coil's position to maximize power transfer.
Implementation Method 1
an induction coil may be provided under the cooking surface and an alternating field may be generated with the induction coil. The varying magnetic field will then induce a current flow in the bottom surface of the cooking vessel. The current flow will generate heat in the bottom of the cooking vessel
Implementation Method 2
The current flow will generate heat in the bottom of the cooking vessel
Implementation Method 3
The induction coil and the bottom of the cooking vessel may be seen as a kind of coupled inductances. This means that the magnetic properties of the cooking vessel influence the inductance of the induction coil. The coupling factor not only depends on the materials of the coil and the cooking vessel. The coupling factor also depends on the spatial overlap between the induction coil and the cooking vessel
Data Source
Figure 1
Figure 2
Figure 3
AI summary
The present invention provides an induction cooking device (100, 200, 300) for heating a cooking vessel (150, 250, 350), the induction cooking device (100, 200, 300) comprising a cooking surface (101, 201, 301) comprising a cooking hob (102, 202, 302), an induction coil (103, 203, 303), a driving circuit (104, 204, 304) electrically coupled to the induction coil (103, 203, 303) and configured to drive the induction coil (103, 203, 303) and determine a power level (106, 206, 306) of the electrical power that is transferred to the induction coil (103, 203, 303) while driving the induction coil (103, 203, 303), and a coil mount (105) that is arranged under the cooking hob (102, 202, 302), wherein the induction coil (103, 203, 303) is arranged on the coil mount (105) and wherein the coil mount (105) is configured to dynamically adapt the position of the induction coil (103, 203, 303) in a plane parallel to the cooking surface (101, 201, 301) based on the determined power level (106, 206, 306). Further, the present invention provides a respective method for operating an induction cooking device (100, 200, 300).