Induction Cooker Duct Cooling Infrared Sensor Precision
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Solution Overview
Problem
Conventional induction heating cookers face challenges in reducing thickness while maintaining temperature sensing precision, as the compact design leads to increased ambient temperatures affecting the infrared sensor, and the layout of components complicates assembly and cooling efficiency.
Innovation Solution
A duct is introduced to form a cooling air path that guides cooling air directly to both the control circuit and infrared sensor, positioned below the top wall to reduce intervening objects and enhance cooling efficiency, with a heat dissipating plate providing magnetic shielding and heat conductivity to manage heat and magnetic fields effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the distance between the infrared sensor and heating coil is reduced to decrease cooker thickness, then the overall thickness is reduced, but the ambient temperature around the infrared sensor increases causing temperature sensing precision to deteriorate
Solution Approach 1:
The internal space is segmented into distinct functional zones: a cooling air path region and a magnetic field shielding region. The duct structure creates a dedicated cooling channel that separates the infrared sensor from the heating coil thermally, while the heat dissipating plate creates a magnetic field barrier. This segmentation allows the sensor to be positioned closer to the heating coil for thinness while maintaining temperature sensing precision through spatial separation of thermal and magnetic influence zones.
Solution Approach 2:
A duct structure is introduced as an intermediary cooling pathway between the heating coil and infrared sensor. This duct guides cooling air directly to the infrared sensor, acting as a thermal mediator that counteracts the heat from the heating coil. Additionally, the heat dissipating plate serves as a dual-function intermediary that provides both magnetic field shielding and thermal management, allowing close proximity while maintaining sensor precision.
2Length of stationary object
If components are compactly arranged to reduce thickness, then the cooker thickness is reduced, but the wiring layout becomes complex reducing ease of manufacture
Solution Approach 1:
The duct structure is merged with the heat dissipating plate to create an integrated component that serves multiple functions: magnetic field shielding, heat dissipation, and cooling air guidance. This merging reduces the number of separate parts and simplifies the overall assembly process. The infrared sensor and control circuit are positioned in the lower region where they can be easily wired together without complex routing, as the duct and heat dissipating plate provide structural pathways for wiring.
3Object-affected harmful factors
If a magnetic field shielding case is used to protect the infrared sensor, then magnetic field shielding is improved, but the ambient temperature inside the case increases reducing cooling efficiency
Solution Approach 1:
The magnetic field shielding function is segmented from the thermal management function. Instead of using a enclosed magnetic field shielding case that traps heat, the patent uses a heat dissipating plate that provides magnetic shielding while being thermally conductive. The duct structure provides a separate cooling pathway that delivers cooling air directly to the infrared sensor without being enclosed by a magnetic shielding case, thus maintaining both magnetic protection and thermal management.
Solution Approach 2:
The conventional magnetic field shielding case (a mechanical enclosure) is replaced with a heat dissipating plate that uses thermal conduction and a duct-based forced convection system. This substitution replaces the enclosed mechanical shielding approach with an open thermal management system that actively removes heat through guided airflow, maintaining magnetic shielding effectiveness while preventing temperature buildup.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves assemblability by simplifying wiring layout, ensures effective cooling of the infrared sensor, and maintains temperature sensing precision even with reduced distance to the heating coil, while reducing the overall thickness of the induction heating cooker.
Implementation Method 1
an infrared sensor that senses infrared radiation radiated from a cooking vessel placed on the top plate
Implementation Method 2
a heat dissipating plate providing magnetic shielding and heat conductivity to manage heat and magnetic fields effectively
Implementation Method 3
A duct is introduced to form a cooling air path that guides cooling air directly to both the control circuit and infrared sensor
Implementation Method 4
a heating coil that inductively heats the cooking vessel 2
Implementation Method 5
a magnetic field shielding member that suppresses magnetic flux leakage from a heating coil disposed below a top plate
Data Source
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AI summary
An object of the present invention is to provide an induction heating cooker with improved assemblability, and with which a reduction in the temperature sensing precision of an infrared sensor can be suppressed and a reduction in the thickness of the induction heating cooker can be achieved. To this end, the induction heating cooker of the present invention includes a duct 33 that forms a cooling air path for guiding the cooling air produced by the air blower 32 to a control circuit 27 and to an infrared sensor 26. The infrared sensor 26 and the control circuit 27 are disposed at positions lower than the top wall of the duct 33.