Induction Cooker Inverter Cooling with Parallel Airflow Fins
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Solution Overview
Problem
Induction heat cooking apparatuses with multiple heating coils require a large number of switching elements, increasing product volume and cost, and face challenges in efficiently dissipating heat generated by these elements.
Innovation Solution
The apparatus incorporates a heat sink with switching elements mounted on it, a cover with radiation fins for improved cooling, and a cooling fan that directs air flow parallel to the fins, along with strategically arranging the bridge diode closer to the fan to enhance heat dissipation, thereby minimizing the number of switching elements needed and improving cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple heating coils are operated using separate inverter circuits, then each coil can be independently controlled, but the number of switching elements increases, increasing product volume and cost
Solution Approach 1:
The patent combines multiple inverter circuits into a single integrated inverter circuit that controls multiple heating coils. Instead of using separate inverters for each coil, the invention uses one inverter with multiple switching elements that can independently control each heating coil through shared components, thereby reducing the overall number of switching elements and product volume while maintaining independent control capability.
Solution Approach 2:
The inverter circuit is designed with multi-functionality to control multiple heating coils using a single circuit configuration. The switching elements can be allocated dynamically to different heating coils based on operational requirements, allowing the same inverter circuit to serve multiple functions and control multiple coils without requiring dedicated inverters for each.
2Adaptability or versatility
If multiple switching elements are used to control multiple heating coils, then each coil can be driven independently, but heat dissipation becomes more difficult and requires larger cooling systems
Solution Approach 1:
Multiple switching elements are mounted on a single heat sink, combining the thermal management function for all switching elements into one centralized cooling structure. This allows efficient heat dissipation through a unified thermal path and reduces the need for multiple separate cooling systems, thereby improving heat dissipation efficiency while maintaining independent control of multiple heating coils.
Solution Approach 2:
The heat sink acts as an intermediary thermal management component that collects and dissipates heat from multiple switching elements. By introducing this intermediate heat dissipation structure, the patent efficiently manages the thermal load generated by multiple switching elements without requiring proportionally larger cooling systems.
3Adaptability or versatility
If a large number of switching elements are used, then multiple heating coils can be controlled, but the contact area with heat sink is insufficient, reducing cooling efficiency
Solution Approach 1:
The switching elements are arranged in a multi-dimensional configuration on the heat sink surface, utilizing both the top surface and side surfaces of the heat sink. This spatial arrangement increases the effective contact area between switching elements and heat sink without requiring a proportional increase in heat sink volume, thereby improving cooling efficiency while supporting control of multiple heating coils.
Solution Approach 2:
The switching elements are positioned in a nested or layered arrangement on the heat sink, where elements are strategically placed to maximize contact area utilization. This nesting approach allows multiple switching elements to be accommodated on the heat sink with optimized thermal contact, increasing the effective heat transfer area without proportionally increasing the number of elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient control and cooling of multiple heating coils using a minimum number of switching elements, reducing the size and cost of the apparatus while effectively managing heat generated by the switching elements and bridge diode.
Implementation Method 1
a radiation fin for cooling the plurality of switching elements is formed on the cover
Implementation Method 2
a radiation fin for cooling the plurality of switching elements is formed on the cover
Implementation Method 3
the bridge diode and the plurality of switching elements may be arranged in a direction parallel to the discharge direction of air discharged from the cooling fan
Implementation Method 4
passing high-frequency current through a working coil or a heating coil and heating a cooking utensil by eddy current flowing when a strong line of magnetic force generated by the high-frequency current passes through the cooking utensil
Implementation Method 5
heating a cooking utensil by eddy current flowing when a strong line of magnetic force generated by the high-frequency current passes through the cooking utensil
Implementation Method 6
The inverter drives a switching element generally composed of an insulated gate bipolar transistor (IGBT) such that high-frequency current flows in the heating coil
Data Source
AI summary
An electronic induction heat cooking apparatus includes a rectifier including a bridge diode, for rectifying an input voltage and outputting a direct current (DC) voltage; a plurality of switching elements for switching the DC voltage output through the rectifier; a controller for controlling the plurality of switching elements; a plurality of heating coils for heating a cooking utensil by controlling the plurality of switching elements; a heat sink having the plurality of switching elements mounted thereon, for cooling the plurality of switching elements; a cover covering the plurality of switching elements; and coupling members for coupling the heat sink to the cover. A radiation fin for cooling the plurality of switching elements is formed on the cover.