Induction Cooktop Thin-Layer Heating With Thermal Isolation

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Solution Overview

Problem

Induction heating type cooktops face inefficiencies in heating non-magnetic objects and risk damage due to high temperatures, as the magnetic field may not effectively reach the object, and the thin layer used for heating can generate excessive heat that damages components.

Innovation Solution

The induction heating type cooktop incorporates a temperature sensor to monitor the thin layer temperature, a heat insulator to block heat transfer, and a bracket to minimize the risk of damage, ensuring efficient heating and component protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If a thin layer is heated above a predetermined temperature (e.g., about 600° C. or more) to enable efficient heating of non-magnetic objects, then heating efficiency is improved, but high temperature heat may be transferred to other components in the cooktop causing damage

Engineering Contradiction:
Improveheating efficiencyVSAvoiddamage to cooktop components
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

A heat insulator is introduced as an intermediary component between the thin layer and the working coil to block heat transfer. The heat insulator prevents high temperature heat from the thin layer (which can reach 600°C or more) from being transferred to the working coil and other components, thereby protecting them from damage while maintaining efficient heating capability

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

A temperature sensor is installed to detect the temperature of the thin layer and provide feedback to the control module. The control module uses this temperature information to control the working coil, preventing the thin layer from exceeding safe temperature thresholds that could damage components, thus resolving the contradiction between heating efficiency and component protection

Inventive Principle:
Principle #23Feedback

2Reliability

If the thickness of the electrical conductor is greater than the skin depth of the electrical conductor, then the magnetic field generated by a coil may not reach the object, but increasing thickness improves structural stability

Engineering Contradiction:
Improveheating effectivenessVSAvoidstructural stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The heating system is segmented into multiple functional layers: the thin layer (electrical conductor) with controlled thickness less than skin depth for effective magnetic field penetration, and the heat insulator layer providing structural stability. This segmentation allows each layer to optimize its function without compromising the other

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The thin layer is designed with specific local quality characteristics - its thickness is precisely controlled to be less than the skin depth of the material at the operating frequency. This local optimization ensures maximum magnetic field penetration and heating effectiveness at the heating interface, while the overall structure maintains stability through the combined multi-layer construction

Inventive Principle:
Principle #3Local quality

3Reliability

If a temperature sensor is installed around an upper plate part to monitor thin layer temperature, then component protection is improved, but the risk of damage to the temperature sensor increases due to high temperature heat

Engineering Contradiction:
Improvecomponent protectionVSAvoiddamage to temperature sensor
Core Design Contradiction:
ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The heat insulator serves as a protective intermediary that creates a thermal barrier between the high-temperature thin layer and the temperature sensor. This allows the temperature sensor to monitor thin layer temperature indirectly without being directly exposed to temperatures that would damage it, maintaining both protection capability and sensor integrity

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The temperature sensor measures temperature at a location that is thermally coupled to the thin layer through the heat insulator, creating a thermal copy or proxy measurement. This indirect measurement approach allows accurate temperature monitoring without exposing the sensor to the full thermal stress of the thin layer operating temperature

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for efficient heating of both magnetic and non-magnetic objects while preventing damage to the cooktop components by monitoring and managing the thin layer temperature, enhancing user convenience and reducing the risk of overheating.

Implementation Method 1

In the induction heating method, an object may be heated by an eddy current flowing through the object made of a metal component. The eddy current may be generated in the object by a magnetic field around a coil in response to predetermined radio frequency power applied to the coil.

Methodology Applied
Scientific EffectElectromagnetic induction: Electromagnetic Induction

Implementation Method 2

a heat insulator that is configured to block heat transfer from the thin layer to the working coil

Methodology Applied
Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

a temperature sensor configured to sense a temperature of the thin layer

Methodology Applied
Scientific EffectThermal sensing: Thermocouple

Data Source

PatentUS11849524B2Induction heating type cooktop
Publication Date: 2023.12.19 LG ELECTRONICS INC
  • US11849524B2 patent drawing
  • US11849524B2 patent drawing
  • US11849524B2 patent drawing

AI summary

An induction heating type cooktop includes a case, a cover plate that is connected to an upper end of the case and that has an upper surface configured to support an object to be heated, a working coil disposed inside the case, a thin layer disposed at the cover plate, a temperature sensor configured to sense a temperature of the thin layer, and a heat insulator that is configured to block heat transfer from the thin layer to the working coil and that defines at least one sensing hole that receives the temperature sensor.