Induction Heating Cooling Structure With Heat Pipe Airflow Path
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Solution Overview
Problem
Induction heating devices with multiple working coils face challenges in independent control and efficient cooling, particularly due to heat generation from IGBTs and limited space for cooling fans.
Innovation Solution
The induction heating device features a modular structure with independently controlled working coils, utilizing a heat sink and heat pipes for efficient heat dissipation, and a dual-fan system to optimize airflow and reduce the number of cooling fans required.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple working coils are used for zone-free heating, then heating versatility is improved, but device complexity increases
Solution Approach 1:
The device is divided into multiple independent heating zones, each with its own working coil and control circuit. This segmentation allows each zone to operate independently, providing heating versatility for different pan sizes and positions while maintaining manageable complexity through modular design
Solution Approach 2:
The heating device is designed to accommodate various pan sizes and positions through multiple working coils that can be selectively activated. The control system universally manages all heating zones, allowing the same device to handle different heating scenarios without requiring separate controls for each zone
2Measurement precision
If multiple IGBTs are used for controlling working coils, then control precision is improved, but heat generation increases
Solution Approach 1:
Multiple IGBTs are integrated into a unified heat dissipation system where heat sinks and cooling fans serve all switching elements collectively. This merging approach allows precise control through multiple IGBTs while managing heat generation through shared cooling infrastructure
Solution Approach 2:
Heat sinks and cooling fans act as intermediary components between the IGBTs and the environment. These intermediaries transfer heat away from the switching elements, enabling precise control through multiple IGBTs without excessive heat accumulation affecting device reliability
3Reliability
If more cooling fans are installed for IGBT cooling, then cooling efficiency is improved, but device complexity increases
Solution Approach 1:
The cooling function is merged into a unified system where heat sinks collect heat from multiple IGBTs and cooling fans distribute cooled air across all heating zones. This combined approach achieves reliable cooling for all components using a single integrated cooling infrastructure rather than separate cooling systems for each zone
4Reliability
If heat dissipation components are added, then heat management is improved, but available space decreases
Solution Approach 1:
Heat dissipation components are arranged in the vertical dimension with heat sinks positioned below working coils and cooling fans mounted on vertical surfaces. This vertical arrangement effectively utilizes available space within the device housing, achieving proper heat management without significantly reducing the horizontal working area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for precise control of each working coil, efficient cooling of IGBTs, and increased space within the device, enhancing user satisfaction and preventing product damage from heat-related issues.
Implementation Method 1
a heat pipe that passes through the heat sink, that extends outward from the induction heating module, and that is configured to discharge heat from the heat sink out of the induction heating module
Implementation Method 2
a cooling fan located at an inner side of the casing and configured to blow air to the air-discharge fan, wherein the heat pipe has an end that protrudes from the induction heating module and that is located at an air-flow path defined between the cooling fan and the air-discharge fan
Implementation Method 3
When power is applied to the induction heating device, a high-frequency voltage of a predetermined magnitude is applied to the working coil. As a result, an inductive magnetic field is generated around the working coil disposed in the induction heating device.
Implementation Method 4
When the flux of the inductive magnetic field passes through a bottom of the loaded object containing the metal loaded on the induction heating device, an eddy current is generated inside of the bottom of the loaded object. When the resulting eddy current flows in the bottom of the loaded object, the loaded object itself is heated.
Data Source
AI summary
An induction heating device includes a casing; a first induction heating module in the casing; a first heat sink located below the first induction heating module; a first heat pipe that passes through the first heat sink, that extends outward from the first induction heating module, and that is configured to discharge heat from the first heat sink out of the first induction heating module; an air-discharge fan located at an inner side of the casing and configured to discharge air from inside of the casing to outside of the casing; and a cooling fan located at the inner side of the casing and configured to blow air to the air-discharge fan. The first heat pipe has an end that protrudes from the first induction heating module and that is located at an air-flow path defined between the cooling fan and the air-discharge fan.