Induction Heating Cooling Structure With Heat Pipe Airflow Layout
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Solution Overview
Problem
Existing induction heating devices with multiple working coils face challenges in independent control and efficient cooling, particularly due to heat generation from insulated gate bipolar transistors (IGBTs) and limited space for cooling fans.
Innovation Solution
The induction heating device features a modular structure with each working coil having a heat sink and heat pipe for efficient heat dissipation, along with a cooling fan and air-discharge fan configuration that reduces the number of cooling fans required, allowing for independent control of each coil and improved cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple working coils are used in a zone-free induction heating device, then heating versatility and adaptability are improved, but the number of IGBTs increases leading to excessive heat generation and difficulty in cooling
Solution Approach 1:
The device is divided into multiple independent heating zones, each with its own working coil and inverter. This segmentation allows each zone to be controlled independently while distributing the thermal load, making cooling more manageable compared to a fully integrated system.
Solution Approach 2:
Heat pipes are introduced as intermediary thermal management components. These heat pipes transfer heat from the IGBTs to dedicated heat sinks, acting as a mediator between the heat-generating components and the cooling system, thereby improving heat dissipation efficiency.
2Temperature
If multiple cooling fans are installed to cool the IGBTs, then cooling efficiency is improved, but the device complexity and space requirements increase
Solution Approach 1:
Multiple heat sinks are merged into a single integrated cooling structure that serves all IGBTs. This consolidation reduces the number of separate cooling fans needed while maintaining effective cooling across all heating zones, thereby reducing device complexity.
Solution Approach 2:
The patent uses heat pipes (thermal conduction technology) to transfer heat efficiently from IGBTs to heat sinks. This passive thermal management approach reduces reliance on active cooling components like multiple fans, simplifying the overall cooling system.
3Adaptability or versatility
If a zone-free configuration with multiple working coils is used, then heating flexibility is improved, but independent control of each coil becomes difficult
Solution Approach 1:
The heating system is segmented into independent zones, each with its own inverter that controls a specific working coil. This modular control architecture allows each zone to be operated independently, simplifying control while maintaining heating flexibility.
Solution Approach 2:
Each inverter is designed as a universal control unit that can independently manage its associated working coil. This multi-functional design allows the same control logic to be applied across all zones, making operation straightforward while maintaining flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient cooling of IGBTs, reduces the number of cooling fans needed, and provides flexible installation options, enhancing the device's performance and usability by allowing independent control of each working coil.
Implementation Method 1
a first heat pipe that passes through the first heat sink, that extends outward from the first induction heating module, and that is configured to discharge heat from the first heat sink out of the first induction heating module
Implementation Method 2
heat may be generated from the IGBTs, which results in heat generation from the device
Implementation Method 3
a cooling fan located at the inner side of the casing and configured to blow air to the air-discharge fan
Implementation Method 4
heat may be transmitted to the loaded object through radiation or conduction to heat the loaded object
Implementation Method 5
an inductive magnetic field is generated around the working coil disposed in the induction heating device. When the flux of the inductive magnetic field passes through a bottom of the loaded object containing the metal loaded on the induction heating device, an eddy current is generated inside of the bottom of the loaded object
Implementation Method 6
an eddy current may be generated in the loaded object made of metal based on a high-frequency power of a predetermined magnitude applied to a working coil
Data Source
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AI summary
The present disclosure relates to an induction heating device with an improved cooling structure. An induction heating device includes a casing; a first induction heating module disposed within the casing; a first heat sink disposed below the first induction heating module to dissipate heat from the first induction heating module; a first heat pipe passing through the first heat sink and extending out of the first induction heating module to discharge the heat dissipated from the first heat sink out of the first induction heating module; an air-discharge fan disposed at one end of an inner edge of the casing to discharge air inside the casing out of the casing; and a cooling fan disposed at another end of the inner edge of the casing to blow air to the air-discharge fan, wherein the first end is opposite to the second end, wherein one end of the first heat pipe protruding out of the first induction heating module is disposed on an air-flow path between the cooling fan and the air-discharge fan.