Induction Curing of Conductive Paste on Photovoltaic Structures
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Solution Overview
Problem
The manual fabrication of solar panels with cascaded photovoltaic strips is time-consuming and error-prone, leading to high production costs and reduced reliability due to increased internal resistance and contact resistance between strips.
Innovation Solution
A system using an induction heater and a wafer carrier with a polybenzimidazole (PBI) plastic surface element to thermally cure conductive paste between overlapping busbars of photovoltaic strips, providing localized heat and efficient bonding without direct contact, reducing thermal conductivity and enhancing heating uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If manual fabrication methods are used for solar panels, then flexibility in assembly is maintained, but production time increases and error rates increase
Solution Approach 1:
The patent replaces manual mechanical assembly with an automated induction heating system that uses electromagnetic fields to cure conductive paste. The system includes an induction heater positioned above a wafer carrier holding multiple photovoltaic structures, enabling simultaneous automated processing without direct mechanical contact with the panels.
2Manufacturing precision
If conventional heating methods are used for curing conductive paste, then heating coverage is broad, but heating uniformity decreases and energy efficiency decreases
Solution Approach 1:
The induction heater provides localized heating directly at the conductive paste location between overlapping busbars. The heating is concentrated where needed rather than broadly distributed, achieving uniform curing of the paste while minimizing energy consumption and avoiding overheating of surrounding photovoltaic structures.
Solution Approach 2:
The patent introduces a wafer carrier with a PBI plastic surface element as an intermediary between the induction heater and photovoltaic structures. This intermediary allows electromagnetic energy to pass through for heating the conductive paste while providing mechanical support and preventing direct contact between the heater and delicate panel components.
3Power
If direct contact heating is used for curing, then heating efficiency increases, but thermal damage to photovoltaic structures increases
Solution Approach 1:
The PBI plastic surface element serves as a non-contact intermediary that allows electromagnetic energy to couple with the conductive paste for efficient heating while preventing direct thermal and mechanical contact with the photovoltaic structures. This intermediary enables high heating efficiency without the harmful effects of direct contact heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method significantly reduces the time and energy required for curing the conductive paste, improves heating uniformity, and increases the throughput of solar panel production while maintaining the integrity of the photovoltaic structures, thereby addressing the challenges of high internal resistance and reliability.
Implementation Method 1
an induction heater positioned above the wafer carrier and including an induction coil that does not directly contact the photovoltaic structures
Implementation Method 2
curing conductive paste applied on photovoltaic structures
Implementation Method 3
a wafer carrier that carries a plurality of photovoltaic structures and including a surface element that is in direct contact with the photovoltaic structures
Data Source
AI summary
One embodiment can provide a system for curing conductive paste applied on photovoltaic structures using induction heating. The system can include a wafer carrier for carrying a plurality of photovoltaic structures and an induction heater. The wafer carrier can include a surface element that is in direct contact with the photovoltaic structures and is substantially thermally insulating. The induction heater can be positioned above the wafer carrier. The induction heater can include a heating coil and core that do not directly contact the photovoltaic structures.