Induction-Heated Wiring Fixing Structure for Dust-Free Ceiling Assembly
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing methods for attaching wire harnesses to molded ceilings using double-sided adhesive tapes face issues with dust adhesion, requiring releasing papers or immediate attachment, which complicates the assembly process.
Innovation Solution
A fixing structure for wiring members featuring a heat generation layer that surrounds the wiring member, an adherend, and a joint layer with bond properties when heated by induction, allowing for secure fixation without the need for releasing papers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a double-sided adhesive tape is used to attach the wiring member to the molded ceiling, then the fixation is simple, but dust adheres to the adhesive tape and tacky adhesion decreases
Solution Approach 1:
The joint layer is prepared in advance with releasing paper protecting its bond properties. The releasing paper is removed only when ready for final attachment, ensuring the joint layer maintains its bonding capability until the moment of fixation. This preliminary preparation allows the adhesive to remain effective without premature dust contamination.
Solution Approach 2:
The releasing paper acts as an intermediary protective layer between the joint layer and the external environment (dust). It preserves the bond properties of the joint layer during storage and handling, and is removed only when the wiring member is ready for final attachment to the molded ceiling.
2Reliability
If a releasing paper is provided on the double-sided adhesive tape to prevent dust adhesion, then tacky adhesion is maintained, but the assembly process becomes more complex
Solution Approach 1:
The joint layer is integrated directly into the wiring member structure, combining the adhesive function with the wiring member itself. The releasing paper is applied only to the necessary bonding surfaces of the joint layer, merging the protective function with the adhesive layer rather than being a separate component.
Solution Approach 2:
The releasing paper is removed only from the specific portions of the joint layer that need to bond, not from the entire wiring member. This selective removal simplifies the assembly process by requiring action only at the bonding interfaces rather than handling entire releasing paper sheets.
3Reliability
If the double-sided adhesive tape is attached immediately to the molded ceiling, then dust adhesion is prevented, but the assembly process is limited
Solution Approach 1:
The joint layer is prepared in advance on the wiring member with releasing paper protection, allowing the wiring member to be positioned and handled without immediate attachment. The actual bonding action is delayed until the final assembly stage, providing flexibility in the assembly process while ensuring adhesion reliability when needed.
Solution Approach 2:
The bonding state of the joint layer is dynamic - protected by releasing paper during handling and positioning, then activated for bonding when the wiring member is ready for final attachment. This dynamic state change allows flexibility in timing and sequence of assembly operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables simple and effective fixation of wiring members to adherends, reducing assembly complexity and weight while maintaining bond integrity.
Implementation Method 1
the heat generation layer is a layer which can generate heat by induction heating
Data Source
AI summary
A fixing structure of a wiring member includes: a wiring member including at least one wire-like transmission member; a heat generation layer provided to surround a periphery of the wiring member; an adherend to which the wiring member is fixed; and a joint layer provided on at least a portion between the heat generation layer and the adherend and a portion between the heat generation layer and the wiring member, wherein the heat generation layer is a layer which can generate heat by induction heating, the joint layer is a layer having bond properties by heat transmitted from the heat generation layer at a time of induction heating, and is joined to the heat generation layer and at least one of the adherend and the wiring member.