Induction Heater Inverter Cooling via Dual-Sided Airflow
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Solution Overview
Problem
Induction heaters face overheating issues due to high heating power and miniaturization demands, requiring effective air cooling solutions to prevent damage to sensitive electronic devices and potential fires.
Innovation Solution
An induction heater design incorporating an inverter body with an inverter circuit board and a heat dissipater that blows air to both the front and rear of the circuit board, utilizing separate heat dissipation spaces and a heat sink to efficiently dissipate heat, with an outlet divider to optimize airflow distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If induction heaters are designed with high heating power and miniaturized size, then heating efficiency and space utilization are improved, but overheating of inverter circuit board occurs
Solution Approach 1:
The air cooling system is segmented into multiple independent channels: a first air cooling channel extending from the front surface to the rear surface of the inverter circuit board, and a second air cooling channel extending from the rear surface to the front surface. This segmentation allows simultaneous cooling of both surfaces with dedicated airflow paths, resolving the overheating issue in miniaturized high-power induction heaters.
Solution Approach 2:
The cooling approach transitions from single-sided cooling to dual-sided cooling by adding air cooling channels in opposite directions (front-to-rear and rear-to-front). This dimensional change in cooling architecture enables effective heat dissipation from both surfaces of the inverter circuit board, preventing overheating in compact high-power designs.
2Temperature
If air cooling channels are added to cool the inverter circuit board, then overheating is prevented, but device complexity increases
Solution Approach 1:
The air cooling channels are merged with the existing inverter circuit board structure rather than being separate external components. The first air cooling channel is formed within the front surface, and the second air cooling channel within the rear surface, integrating cooling functionality into the board itself and reducing overall device complexity.
Solution Approach 2:
The inverter circuit board serves multiple functions: it provides electrical connections, houses electronic components, and incorporates integrated air cooling channels for thermal management. This multi-functionality reduces the need for separate cooling components, thereby preventing overheating without significantly increasing device complexity.
3Temperature
If air is blown to both front and rear of the inverter circuit board, then heat dissipation is improved, but air leakage increases
Solution Approach 1:
The potential air leakage issue is converted into a beneficial feature by designing the air cooling channels to extend through the entire thickness of the inverter circuit board. The channels are properly sealed within the board structure, allowing controlled airflow for cooling while preventing unwanted leakage, thus turning a potential harm into a benefit.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents overheating of the inverter circuit board, enables miniaturization, and allows for the integration of more devices, while minimizing air leakage and ensuring thorough heat dissipation from both the front and rear surfaces.
Implementation Method 1
a heat dissipater which is configured to blows air to a front and a rear of the inverter circuit board
Implementation Method 2
a heat sink which is provided on the top surface of the inverter circuit board, and wherein the heat sink dissipates heat from the inverter circuit board
Implementation Method 3
Induction heaters induce an electric current in a metal utensil (e.g., a cooking utensil) using an electromagnetic force and can thus heat the metal utensil
Implementation Method 4
induction heaters generate a considerable amount of heat using an electromagnetic force
Data Source
Figure 1
Figure 2~3
Figure 4~5
AI summary
Provided is an induction heater which induces an electric current in a metal utensil (e.g., a cooking utensil) using an electromagnetic force and can thus heat the metal utensil, and more particularly, an induction heater which can prevent electric devices sensitive to temperature from being overheated by forcefully blowing air to the front and the rear of an inverter circuit board. The induction heater is easy to be miniaturized, and a considerable number of devices can be integrated into the induction heater.