Induction Heating Device Assembly with Hole-Based Cooling Airflow
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Solution Overview
Problem
The assembly process of zone-free type induction heating devices is complicated due to multiple working coils, and the cooling performance is affected, leading to potential damage from heat and increased repair costs.
Innovation Solution
The induction heating device features a case with a working coil, base plate, indicator substrate support, and resonance substrate, where the base plate defines holes corresponding to the working coil's inner side, allowing for improved assembly and airflow for cooling, with a blowing fan to dissipate heat and reduce component damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple working coils are used in a zone-free induction heating device, then heating versatility is improved, but assembly complexity increases
Solution Approach 1:
The device divides the heating area into multiple independent zones, each with its own working coil that can be independently controlled. This segmentation allows different heating patterns and power levels for different cooking tasks, improving versatility while maintaining manageable assembly through modular design
Solution Approach 2:
The induction heating device is designed to handle multiple cooking functions (simultaneous heating of multiple vessels, different power levels, various heating patterns) through a unified control system that manages multiple working coils, achieving multi-functionality without proportionally increasing assembly complexity
2Power
If multiple working coils are installed in the device, then heating capability is improved, but cooling performance deteriorates
Solution Approach 1:
The cooling system is segmented into multiple independent cooling channels, each serving specific high-heat components. This includes separate cooling paths for different working coils and their associated circuit boards, allowing efficient heat dissipation across the entire device despite multiple heat-generating elements
Solution Approach 2:
Heat dissipation fins are introduced as intermediary structures between the working coils and the surrounding air. These fins increase the surface area for heat transfer and facilitate convective cooling, acting as a mediator that enhances cooling performance without requiring direct modification of the working coils themselves
3Device complexity
If adequate cooling is not provided, then device simplicity is maintained, but component reliability decreases due to heat damage
Solution Approach 1:
Heat dissipation fins serve as intermediary thermal management components that passively enhance cooling without adding complex active cooling systems. These fins provide adequate cooling protection for components while maintaining relatively simple device architecture
Solution Approach 2:
The cooling system is designed to operate passively through natural convection and radiation, with heat dissipation fins that automatically dissipate heat from working coils and components without requiring external control or additional energy input, maintaining simplicity while ensuring component reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies the assembly process, enhances cooling performance, reduces the risk of component damage from heat, and improves durability, thereby reducing repair costs.
Implementation Method 1
In the induction heating method, eddy current may be generated in the object made of metal based on a magnetic field generated, around the coil, based on a high-frequency power having a predetermined magnitude applied to the coil to heat the object
Implementation Method 2
eddy current may be generated in the object made of metal based on a magnetic field generated, around the coil
Implementation Method 3
a blowing fan to dissipate heat
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
An induction heating device includes a case, a working coil, a base plate that is disposed vertically below the working coil, an indicator substrate support that is coupled to the case and that is disposed vertically below the base plate, an indicator substrate that is disposed on an upper surface of the indicator substrate support, that is disposed vertically below the base plate, and that is spaced apart from the base plate, an inverter substrate that is disposed at a lower surface of the indicator substrate support and that includes an inverter configured to apply a resonance current to the working coil through a switching operation, and a resonance substrate that is disposed at the lower surface of the indicator substrate support, that is connected to the working coil, and that includes a resonance capacitor configured to generate the resonance current based on the switching operation of the inverter.