Induction Heating Device Cooling Structure
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Solution Overview
Problem
Induction heating devices with existing cooling structures require additional components and molds, increasing material and manufacturing costs, and result in a higher product height, making it difficult to produce compact designs that effectively manage the temperature of critical components like inverter and resonance substrates and working coils.
Innovation Solution
The induction heating device incorporates a case with inlet and exhaust slits, a rear fence and supporting guide on the indicator substrate support, and multiple blowing fans to control the temperature of inverter, resonance, and working coil substrates without additional injection components, reducing the product's height and manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fan cover is added to guide air flow and prevent heat leakage, then temperature control of PCB is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The fan cover is merged with the case to form an integrated structure. The case includes a blowing fan and a fan cover that prevents heat discharged by the heat sink from leaking to other components or substrate, while also functioning as an air flow path to guide heat discharged from the heat sink. This integration eliminates the need for separate cooling components while maintaining effective temperature control.
2Temperature
If a fan cover is added to guide air flow, then temperature control of PCB is improved, but material cost and manufacturing cost increase
Solution Approach 1:
The fan cover is merged with the case to form an integrated structure. The case includes a blowing fan and a fan cover that prevents heat discharged by the heat sink from leaking to other components or substrate, while also functioning as an air flow path to guide heat discharged from the heat sink. This integration eliminates the need for separate cooling components while maintaining effective temperature control.
3Temperature
If a fan cover is added to guide air flow path, then temperature control is improved, but product height increases
Solution Approach 1:
The air flow path is designed to move horizontally through the case rather than vertically. The blowing fan blows air toward the heat sink, and the fan cover guides the air flow path horizontally to discharge heat from the heat sink, avoiding the need for vertical space that would increase product height.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively manages the temperature of critical components, enhances product reliability, maintains performance, and minimizes the risk of indicator damage, while allowing for compact product design by eliminating the need for extra components and reducing height.
Implementation Method 1
an induction heating device may include a blowing fan 20 and a fan cover 50 in an inside of a case 10 to reduce heat (i.e., a temperature) of a printed circuit board (PCB) 30... the temperature of the PCB 30 is reduced due to the air discharged by the blowing fan 20 while passing through a heat sink 40
Implementation Method 2
the temperature of the PCB 30 is reduced due to the air discharged by the blowing fan 20 while passing through a heat sink 40
Data Source
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AI summary
According to an embodiment of the present disclosure, the induction heating device includes a case including a lower plate and a side plate, the case comprising an inlet and an exhaust slit at a portion of an area of the lower plate; a cover plate coupled to the side plate; a working coil provided inside of the case; an indicator substrate support coupled to the lower plate; an inverter substrate installed on a lower surface of the indicator substrate support and including an inverter that applies a resonance current to the working coil and a first heat sink that radiates heat of the inverter; and a first blowing fan installed on the lower plate and being configured to suction outside air through the inlet, and the air discharged from the first blowing fan into the inverter substrate is discharged below the lower plate through the exhaust slit.