Induction Heating Cooling Structure with Heat Pipes and Airflow
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Solution Overview
Problem
Existing induction heating devices with multiple working coils face challenges in independent control and efficient cooling, particularly due to space constraints and heat generation issues from insulated gate bipolar transistors (IGBTs), which complicates the management of heating zones and increases the number of cooling fans required.
Innovation Solution
The induction heating device features a modular structure with independently controllable working coils, utilizing a heat sink and heat pipes for efficient heat dissipation, combined with a cooling fan and air-discharge fan configuration that reduces the number of cooling fans needed, allowing for effective airflow and heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple working coils are used in a zone-free induction heating device, then heating versatility is improved, but device complexity increases making independent control difficult
Solution Approach 1:
The device is divided into multiple independent heating zones, each with its own working coil and control circuitry. This segmentation allows each zone to be controlled independently while maintaining the overall zone-free heating capability, resolving the contradiction between versatility and control complexity.
2Temperature
If multiple cooling fans are installed to cool IGBTs, then cooling efficiency is improved, but space availability deteriorates
Solution Approach 1:
Multiple cooling functions are merged into a single cooling fan system. The patent uses one cooling fan that serves multiple IGBT modules simultaneously, eliminating the need for separate cooling fans for each IGBT. This merging approach maintains effective cooling while significantly reducing the number of cooling components and freeing up device space.
3Temperature
If more cooling fans are provided, then heat dissipation from IGBTs is improved, but the number of components increases
Solution Approach 1:
A single cooling fan is designed to perform multiple cooling functions simultaneously, serving different IGBT modules and heat-generating components. This multi-functional approach ensures adequate heat dissipation across all components without requiring multiple dedicated cooling fans, thereby reducing the total component count and simplifying the device structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables independent control of each working coil, improves cooling efficiency for IGBTs, reduces the number of cooling fans, and optimizes space usage, enhancing the device's performance and usability by allowing for flexible installation and efficient heat management.
Implementation Method 1
a first heat sink located vertically below the first induction heating module and configured to dissipate heat from the first induction heating module
Implementation Method 2
a first heat pipe that passes through the first heat sink, that extends outward from the first induction heating module, and that is configured to discharge heat from the first heat sink out of the first induction heating module
Implementation Method 3
a cooling fan located at the inner side of the casing and configured to blow air to the air-discharge fan, where the cooling fan is spaced apart from the air-discharge fan at the inner side. The first heat pipe has an end that protrudes from the first induction heating module and that is located at an air-flow path defined between the cooling fan and the air-discharge fan
Implementation Method 4
an air-discharge fan located at an inner side of the casing and configured to discharge air from inside of the casing to outside of the casing
Implementation Method 5
an inductive magnetic field is generated around the working coil disposed in the induction heating device. When the flux of the inductive magnetic field passes through a bottom of the loaded object containing the metal loaded on the induction heating device, an eddy current is generated inside of the bottom of the loaded object
Implementation Method 6
When the resulting eddy current flows in the bottom of the loaded object, the loaded object itself is heated
Data Source
Figure 1~2
Figure 3
Figure 4
AI summary
The present disclosure relates to an induction heating device with an improved cooling structure. An induction heating device includes a casing; a first induction heating module disposed within the casing; a first heat sink disposed below the first induction heating module to dissipate heat from the first induction heating module; a first heat pipe passing through the first heat sink and extending out of the first induction heating module to discharge the heat dissipated from the first heat sink out of the first induction heating module; an air-discharge fan disposed at one end of an inner edge of the casing to discharge air inside the casing out of the casing; and a cooling fan disposed at another end of the inner edge of the casing to blow air to the air-discharge fan, wherein the first end is opposite to the second end, wherein one end of the first heat pipe protruding out of the first induction heating module is disposed on an air-flow path between the cooling fan and the air-discharge fan.