Induction Heating Element for Hermetic Organic Substrate Sealing
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Solution Overview
Problem
Existing methods for sealing organic substrates, such as ultrasonic welding and soldering, can damage the substrate due to high energy input, and require metallization or high-temperature soldering, while gluing processes struggle to create a hermetically sealed connection with low thermal stress.
Innovation Solution
A covering device with a heating element in the connection zone that allows for localized melting of the closure cap and substrate, or the use of a solder/adhesive, to establish a hermetically sealed connection with reduced thermal stress, using Joule heating to achieve high temperatures without unnecessary substrate heating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If ultrasonic welding is used to fix the sealing cap, then the connection strength is improved, but the organic substrate is damaged due to high energy input
Solution Approach 1:
The patent applies local quality by concentrating the heating action only at the connection zone between the sealing cap and substrate through a localized heating element, rather than applying energy uniformly across the entire substrate. This localized approach melts only the necessary areas for bonding while leaving the rest of the organic substrate unaffected, thus achieving strong connections without substrate damage.
2Reliability
If soldering is used to fix the sealing cap, then the hermetic seal is improved, but the substrate is damaged due to high soldering temperature
Solution Approach 1:
The heating element is positioned to provide localized heating only at the connection zone where the sealing cap meets the substrate. This allows soldering or adhesive activation to occur precisely where needed for hermetic sealing, while the temperature remains low enough in the surrounding substrate areas to avoid damage to the organic material and protected components.
Solution Approach 2:
The heating element acts as an intermediary that enables controlled thermal activation of the connection process. By mediating the thermal energy transfer locally, it allows soldering or adhesive bonding to proceed at lower overall temperatures than conventional methods, protecting the substrate while still achieving reliable hermetic seals.
3Manufacturing precision
If conventional heating methods are used, then the connection zone is heated, but areas further away from the connection zone are unnecessarily subjected to thermal stress
Solution Approach 1:
The heating element is designed and positioned to provide highly localized heating precisely at the connection zone. This ensures that thermal energy is concentrated only where needed for bonding, creating a steep temperature gradient that allows the connection zone to reach melting or activation temperatures while areas further away remain at low temperatures, avoiding unnecessary thermal stress.
Solution Approach 2:
The heating process is segmented spatially through the localized heating element, separating the high-temperature connection zone from the low-temperature substrate areas. This segmentation allows independent temperature control at different locations, enabling precise heating of only the connection zone without propagating thermal stress to other parts of the substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables a tight, hermetically sealed connection between the closure cap and organic substrate with minimized thermal stress on the substrate and components, allowing for the use of cost-effective organic materials like LCP, while reducing energy input and avoiding damage from high-energy processes.
Implementation Method 1
the connection zone comprises, at least in some areas, a heating element for heating the connection zone when producing a connection between the closure cap and the substrate
Data Source
Figure 1A~1B
Figure 2A~2C
Figure 3A~3B
AI summary
The covering device comprises heating element (12) that is arranged within substrate (10) for heating connecting zone (18) in preparation of compound (40) between closure cap (30) and substrate by induction and radio frequency (RF) coupling. The substrate is made of thermoplastic. The closure cap is made of metal. Independent claims are included for the following: (1) substrate; and (2) method for manufacturing covering device.