Induction Heating Wafer Boat for Semiconductor Processing
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Solution Overview
Problem
Conventional heat treatment apparatuses for semiconductor wafers require significant energy to heat the treatment chamber, leading to inefficient energy use, unnecessary film deposition on chamber surfaces, and slow temperature control, which can affect semiconductor processing.
Innovation Solution
The apparatus employs induction heating using a coil around the treatment chamber to heat objects directly, without heating the chamber, using an induction heating generator made of conductive materials like ceramic or graphite, allowing for precise temperature control and reduced energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heater is provided on the outer circumferential side of the treatment chamber to heat wafers by Joule heat, then the wafers can be heated to required temperature, but the treatment chamber with large heat capacity consumes significantly increased energy
Solution Approach 1:
The heating function is segmented from the treatment chamber structure. Instead of heating the entire chamber, only the wafer holder (boat) is heated by induction, while the chamber remains at ambient or lower temperature. This segmentation eliminates the energy waste of heating the chamber's large thermal mass.
Solution Approach 2:
The conventional Joule heating mechanism (resistive heating via heater elements) is replaced with induction heating (electromagnetic field heating). The induction heating coil generates an alternating magnetic field that directly induces eddy currents in the conductive wafer holder, heating it efficiently without requiring the chamber to be heated.
2Temperature
If the treatment chamber is heated to high temperature, then the wafers can undergo heat treatment, but unnecessary film deposits on the chamber inner wall and wafer surfaces
Solution Approach 1:
The heating is localized to the wafer holder only, not the entire chamber. This creates a temperature gradient where the wafer area is hot while the chamber walls remain cool, preventing film deposition on chamber surfaces while still enabling high-temperature processing of wafers.
Solution Approach 2:
The induction heating method converts what would be a harmful effect (heat causing film deposition) into a beneficial localized effect. By using electromagnetic induction, heat is generated only where needed (in the conductive holder), and the chamber environment can be maintained at conditions that prevent unwanted deposition.
3Speed
If the treatment chamber temperature is quickly increased and decreased, then temperature control speed improves, but the large heat capacity of the chamber makes this extremely difficult
Solution Approach 1:
The thermal mass is segmented by heating only the small wafer holder rather than the entire large chamber. This dramatically reduces the effective heat capacity that must be changed, enabling rapid temperature cycling for the wafers while the chamber remains thermally stable.
Solution Approach 2:
The system achieves dynamic temperature control by independently controlling the induction heating power to the wafer holder. The holder can be rapidly heated or cooled by adjusting the induction power, while the chamber temperature remains relatively constant, enabling fast process cycling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reduces energy consumption, prevents unnecessary film deposition, and enables rapid temperature increases and decreases of semiconductor wafers, improving processing efficiency and reducing cleaning cycles.
Implementation Method 1
an induction heating generator, the induction heating generator being adapted to be inductively heated by means of a high frequency wave emitted by the induction heating coil and to thereby heat the object
Implementation Method 2
an induction heating generator, the induction heating generator being adapted to be inductively heated by means of a high frequency wave emitted by the induction heating coil
Implementation Method 3
a high frequency power supply that is connected with the induction heating coil section and adapted to apply high frequency power to the induction heating coil section
Data Source
AI summary
A treatment apparatus uses an inductive heating method to allow an object to be heated while preventing a treatment chamber from being heated. The treatment apparatus for performing a heat treatment on the object has a treatment chamber and an induction heating coil section. The treatment chamber is capable of accommodating a plurality of objects. The induction heating coil section is wound around an outer circumference of the treatment chamber. The treatment apparatus also has a high frequency power supply and a gas supply unit. The high frequency power supply applies high frequency power to the induction heating coil section. The gas supply unit introduces a necessary gas to the treatment chamber. A holding unit is inserted in and removed from the treatment chamber under the condition that the holding unit holds the object and an induction heating generator adapted to be inductively heated by means of a high frequency wave emitted by the induction heating coil section.