Induction Hob Power Circuit With Common Heat Sink

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Solution Overview

Problem

Existing cooking appliances, particularly induction hobs, face challenges in achieving cost-effectiveness and weight reduction while efficiently utilizing a power supply network with only two conductors, often requiring complex and costly components for operation.

Innovation Solution

A circuit device with a single-piece heat sink and at most two heating frequency units is designed for connection to two conductors, utilizing a single heat sink for thermal management and integrating a simplified power assembly with a single rectifier and cooling fan, reducing the need for galvanic isolation and optimizing components for two-conductor operation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Weight of moving object

If a circuit device is designed for connection to two conductors of a power supply network, then cost savings and weight reduction are achieved, but the power output and versatility are limited compared to three-conductor designs

Engineering Contradiction:
Improveweight of circuit deviceVSAvoidpower output capability
Core Design Contradiction:
Weight of moving objectVSAdaptability or versatility

Solution Approach 1:

The patent merges the functions of multiple heating frequency units into a single integrated circuit device that can operate with only two conductors. The circuit device combines power conversion, heating control, and power supply functions in one unit, eliminating the need for separate components and galvanic isolation that would increase weight. This consolidation maintains adequate power output for everyday use while achieving weight reduction and cost savings.

Inventive Principle:
Principle #5Merging (Combining)

2Ease of manufacture

If a single-piece heat sink is used for thermal management, then manufacturing cost and assembly complexity are reduced, but thermal management efficiency may be compromised compared to multi-piece designs

Engineering Contradiction:
Improvemanufacturing simplicityVSAvoidthermal management efficiency
Core Design Contradiction:
Ease of manufactureVSTemperature

Solution Approach 1:

The patent integrates the heat sink as a single-piece component that is thermally coupled to the heating frequency units. This monolithic design eliminates the need for multiple separate heat sink pieces and complex assembly processes, reducing manufacturing cost and assembly complexity while providing adequate thermal management for the circuit device's power dissipation requirements.

Inventive Principle:
Principle #5Merging (Combining)

3Temperature

If heating frequency units are thermally contacted with a common heat sink, then thermal management is simplified, but the device complexity and cost increase

Engineering Contradiction:
Improvethermal managementVSAvoidcircuit device complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent integrates thermal management directly into the circuit device by providing a common heat sink that is thermally coupled to the heating frequency units. This integration simplifies the overall system by combining thermal management functionality with the power conversion and heating control functions in a single device, reducing the need for separate thermal management components and lowering overall device complexity and cost.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design achieves significant cost savings, weight reduction, and energy efficiency by minimizing component complexity and transportation costs, while maintaining high user-friendliness and power output adequacy for everyday use.

Implementation Method 1

a circuit device with at most one single-piece heat sink (44) with which the at least two heating frequency units (34) are thermally contacted

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

the heat sink has a surface area at least five times, particularly at least ten times, and advantageously at least twenty times larger than that of a cube of the same volume, and comprises, in particular, at least three and preferably at least five cooling fins

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentEP2506671B2Switch device
Publication Date: 2025.12.24 BSH HAUSGERATE GMBH
  • EP2506671B2 patent drawingFigure 1~2
  • EP2506671B2 patent drawingFigure 3

AI summary

The device has a high frequency unit (34a) i.e. inverter, for supplying energy to three independent heating units (14a-20a) e.g. inductor coils. The high frequency unit is thermally contacted with an integrated cooling body (44a). A cooling ventilator (46a) cools the cooling body. Two equipotential connecting paths (22a, 24a) are provided between a filter assembly (10a) and a power assembly (12a), and transfer large part of energy from the filter assembly to the heating units. A current supply unit (38a) supplies the energy to a control unit (40a).