Cooling system for an induction hob
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing cooling systems for induction hobs are inefficient in utilizing the airflow generated by blowers to cool all electronic components, particularly as they often require separate airflow paths for heat-sinks and other components, leading to suboptimal cooling efficiency and increased temperatures.
Innovation Solution
A cooling system that uses an air blower to generate airflow, which is then conveyed through a heat-sink device with radiant elements and deflected using curved deflectors to distribute the airflow effectively across all components, including those not directly connected to the heat-sink, enhancing the overall cooling capacity and efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the airflow generated by the blower is used only to cool heat-sink connected components, then the cooling efficiency for those components is improved, but other electronic components such as capacitors are not adequately cooled
Solution Approach 1:
The airflow generated by the blower is divided into multiple paths using deflectors. One path directs airflow through the heat-sink for cooling power electronic components, while another path deflects airflow to cool other electronic components such as capacitors. This segmentation allows different regions of the electronic board to receive targeted cooling without requiring separate blowers or complex cooling systems.
Solution Approach 2:
Different regions of the electronic board receive customized cooling based on their specific thermal requirements. Power electronic components connected to the heat-sink receive high-velocity airflow directly through the heat-sink fins, while other components receive deflected airflow from the same blower. This local quality approach ensures each component receives appropriate cooling intensity without over-cooling or under-cooling any specific area.
2Reliability
If separate airflow paths are used to cool different electronic components, then each component can be cooled effectively, but the device complexity and number of components increase
Solution Approach 1:
A single blower serves multiple cooling functions by generating one airflow that is then distributed through different paths. The same blower cools both heat-sink connected components and other electronic components through the use of deflectors. This multi-functionality reduces the number of required cooling components from multiple blowers or complex cooling systems to a single blower with simple deflector mechanisms.
Solution Approach 2:
The cooling system merges multiple cooling functions into a single integrated system. Instead of using separate blowers or independent cooling circuits for different components, the invention combines all cooling functions into one airflow generation system with a single blower that serves the entire electronic board through strategic airflow deflection and distribution.
3Device complexity
If the airflow is not deflected, then the system structure is simpler, but the cooling capacity and efficiency are reduced
Solution Approach 1:
The deflector uses a curved surface geometry to redirect the airflow from the blower. The curved shape of the deflector smoothly guides the airflow at an angle, allowing it to reach electronic components that are not directly in line with the blower output. This curved geometry is more space-efficient and aerodynamically effective than sharp angles or multiple straight segments.
Solution Approach 2:
The deflector redirects airflow from a horizontal path into a vertical or angled path, utilizing a different spatial dimension to reach components positioned above or at angles relative to the blower. This dimensional change in airflow direction allows comprehensive cooling coverage without increasing the horizontal footprint of the cooling system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution optimizes the use of airflow to cool both heat-sink connected components and other electronic components, such as capacitors, by deflecting a portion of the airflow to provide 'fresh' cooling, thereby reducing temperatures and improving the reliability and lifespan of components.
Implementation Method 1
the cooling system has electronic components directly mounted on the heat-sink which are then cooled through forced convection systems
Implementation Method 2
electronic components are placed on such electronic boards together with heat-sinks to which they are connected, for dissipating heat
Data Source
AI summary
A cooling system for a built-in induction hob with an improved cooling efficiency, and a cooling method thereof. The cooling system comprises an air blower for generating an airflow according to a first direction, a heat-sink device through which air blown by the air blower is conveyed. The cooling system further comprises airflow deflecting means for deflecting said airflow from said first direction to a second direction which significantly deviates from said first direction.